Attribute
Description
Manufacturer Part Number
EVSF100FG-70
Manufacturer
Description
Thermal Pad (EverTherm)
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | EVSF | |
| IC Encapsulation Type | Sheet | |
| Availability Status | Active | |
| Intended Usage Scenario | Multi | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | - | |
| Dimensional Outline Drawing | 200.00mm x 300.00mm | |
| Material Thickness Gauge | 0.0098" (0.250mm) | |
| Construction Material Type | - | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | White | |
| Material Heat Resistance | 0.9°C/W | |
| Heat Transfer Coefficient | 1.0W/m-K |
Description
Available in a color identified as White to enhance system aesthetics. Contour 200.00mm x 300.00mm for device shape and footprint. Enclosure Sheet for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series EVSF. Thermal conductivity value 1.0W/m-K for heat transfer efficiency. Thermal resistivity value 0.9°C/W for insulation or material effectiveness. Thickness measurement 0.0098" (0.250mm) for material or component size. Category Gap Filler Pad, Sheet for classification or specification. Application Multi for intended use or function.
