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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | * | |
| IC Encapsulation Type | Spool | |
| Availability Status | Active | |
| Adhesive Tape Category | High Temp Polyimide Aerogel | |
| Bonding Agent Type | Silicone | |
| Support Layer Material | Carrier - Polyimide Aerogel Film, Substrate - VDA Polyimide Film | |
| Material Thickness Gauge | 0.0095" (9.5 mils, 0.241mm) | |
| Adhesive Layer Depth | 0.0010" (1.0 mils, 0.025mm) | |
| Carrier Backing Depth | 0.0065" (6.5 mils, 0.165mm) | |
| Horizontal Width Dimension | 1.00" (25.40mm) | |
| Linear Length Dimension | 25' (7.6m) 8.3 yds | |
| Visual Hue | - | |
| Intended Usage Scenario | Thermal Insulation | |
| Operating Temp Limits | - |
Description
Uses Silicone adhesive for durable bonding. Made with Carrier - Polyimide Aerogel Film, Substrate - VDA Polyimide Film backing/carrier materials for longevity. Total length 25' (7.6m) 8.3 yds for size reference. Enclosure Spool for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series *. Type of tape High Temp Polyimide Aerogel for packaging or insulation applications. Thickness measurement 0.0095" (9.5 mils, 0.241mm) for material or component size. Adhesive layer thickness 0.0010" (1.0 mils, 0.025mm) for bonding purposes. Thickness of backing or carrier 0.0065" (6.5 mils, 0.165mm) for tape or film. Application Thermal Insulation for intended use or function. Horizontal dimension width 1.00" (25.40mm).
