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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Correct-A-Chip® 350000 | |
| IC Encapsulation Type | Tube | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | SOIC | |
| Switch Position Options | 20 | |
| Component Spacing Distance | 0.050" (1.27mm) | |
| Circuit Board Depth | 0.062" (1.57mm) 1/16" | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | 2.000" L x 0.450" W (50.80mm x 11.43mm) |
Description
Features a board thickness rated at 0.062" (1.57mm) 1/16" for robust structural support. Material type FR4 Epoxy Glass for reliability and performance. Total positions 20 for switches or mechanical elements. Enclosure Tube for component protection or transport. Formats accepted SOIC for production or assembly. Spacing 0.050" (1.27mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Development board type SMD to DIP for prototyping. Product or component classification series Correct-A-Chip® 350000. Dimensions 2.000" L x 0.450" W (50.80mm x 11.43mm) for mechanical or electrical components. Dimension measurement 2.000" L x 0.450" W (50.80mm x 11.43mm) for component details.
