EPM2210F324C5N

EPM2210F324C5N
Attribute
Description
Manufacturer Part Number
EPM2210F324C5N
Manufacturer
Description
IC CPLD 1700MC 7NS 324FBGA
Note : GST will not be applied to orders shipping outside of India

Stock:
3528

Distributor: 145

Lead Time: Not specified

Quantity Unit Price Ext. Price
13 ₹ 2,446.81 ₹ 31,808.53
10 ₹ 2,729.14 ₹ 27,291.40
8 ₹ 2,823.24 ₹ 22,585.92
6 ₹ 2,917.36 ₹ 17,504.16
4 ₹ 3,011.46 ₹ 12,045.84
2 ₹ 3,670.22 ₹ 7,340.44

Stock:
5

Distributor: 113

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 3,442.52 ₹ 3,442.52
10 ₹ 5,218.07 ₹ 52,180.70
100 ₹ 4,698.31 ₹ 4,69,831.00

Stock:
5

Distributor: 120

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 3,738.00 ₹ 3,738.00

Stock:
383

Distributor: 117

Lead Time: Not specified


Quantity Unit Price Ext. Price
100 ₹ 7,952.56 ₹ 7,95,256.00
25 ₹ 8,465.95 ₹ 2,11,648.75
1 ₹ 8,832.09 ₹ 8,832.09

Stock:
18

Distributor: 108

Lead Time: Not specified


Quantity Unit Price Ext. Price
1 ₹ 8,697.08 ₹ 8,697.08

Stock:
4

Distributor: 118

Lead Time: Not specified


Quantity Unit Price Ext. Price
5 ₹ 9,477.75 ₹ 47,388.75
3 ₹ 10,004.29 ₹ 30,012.87
1 ₹ 10,530.84 ₹ 10,530.84

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line MAX® II
IC Encapsulation Type Tray
Availability Status Active
Reconfigurable Device Type In System Programmable
Maximum Propagation Delay 7 ns
Onboard Voltage Regulator 2.5V, 3.3V
Logic Block Resources 2210
Programmable Macrocell Count 1700
Logic Gate Total -
Input/Output Port Count 272
Ambient Temp Range 0°C ~ 85°C (TJ)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 324-BGA
Vendor Package Type 324-FBGA (19x19)

Description

Presents maximum tpd(1) delay quantified as 7 ns. Mounting style Surface Mount for structural integrity. Total I/O 272 for electronic links. Total logic elements/blocks 2210 for FPGA or digital design. Total macrocells 1700 for digital logic integration. Operating temperature 0°C ~ 85°C (TJ) for thermal stability. Enclosure Tray for component protection or transport. Enclosure/case 324-BGA providing mechanical and thermal shielding. Enclosure type 324-FBGA (19x19) ensuring device integrity. Product condition Active for availability and lifecycle. Configurable type In System Programmable for device setup. Product or component classification series MAX® II. Manufacturer package type 324-FBGA (19x19) for component choice. Internal voltage supply 2.5V, 3.3V for devices.

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