Attribute
Description
Manufacturer Part Number
OM13496UL
Manufacturer
Description
SURFACE MOUNT TO DIP EVALUATION
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Not For New Designs | |
| Assembly Kit Category | Adapter, Breakout Boards | |
| Item Quantity Available | 23 Pieces (4 Values - Mixed Quantities) | |
| Supported Package Formats | QSOP, TSSOP28, XFBGA, XQFN | |
| Technical Specifications | SMD to DIP | |
| Switch Position Options | 16, 28 |
Description
Features Adapter, Breakout Boards kit type for its specific use. Total positions 16, 28 for switches or mechanical elements. Enclosure Bulk for component protection or transport. Formats accepted QSOP, TSSOP28, XFBGA, XQFN for production or assembly. Product condition Not For New Designs for availability and lifecycle. Available quantity 23 Pieces (4 Values - Mixed Quantities) for orders or inventory. Details SMD to DIP for comprehensive product information.
