Attribute
Description
Manufacturer Part Number
OM13491UL
Manufacturer
Description
SURFACE MOUNT TO DIP EVALUATION
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Assembly Kit Category | Adapter, Breakout Boards | |
| Item Quantity Available | 42 Pieces (5 Values - Mixed Quantities) | |
| Supported Package Formats | HWSON, MSOP, SO, VSSOP, XQFN | |
| Technical Specifications | SMD to DIP | |
| Switch Position Options | 8 |
Description
Features Adapter, Breakout Boards kit type for its specific use. Total positions 8 for switches or mechanical elements. Enclosure Bulk for component protection or transport. Formats accepted HWSON, MSOP, SO, VSSOP, XQFN for production or assembly. Available quantity 42 Pieces (5 Values - Mixed Quantities) for orders or inventory. Details SMD to DIP for comprehensive product information.
