SI8810EDB-T2-E1

SI8810EDB-T2-E1
Attribute
Description
Manufacturer Part Number
SI8810EDB-T2-E1
Manufacturer
Description
MOSFET N-CH 20V 2.1A MICROFOOT
Note : GST will not be applied to orders shipping outside of India

Stock:
3000

Distributor: 113

Lead Time: Not specified

Quantity Unit Price Ext. Price
3000 ₹ 17.19 ₹ 51,570.00
9000 ₹ 16.95 ₹ 1,52,550.00
12000 ₹ 16.82 ₹ 2,01,840.00
30000 ₹ 16.57 ₹ 4,97,100.00
45000 ₹ 16.32 ₹ 7,34,400.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line TrenchFET®
IC Encapsulation Type Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Availability Status Active
Field Effect Transistor Type N-Channel
Core Technology Platform MOSFET (Metal Oxide)
Drain-Source Breakdown Volts 20 V
Continuous Drain Current at 25C 2.1A (Ta)
Gate Drive Voltage Range 1.5V, 4.5V
Max On-State Resistance 72mOhm @ 1A, 4.5V
Max Threshold Gate Voltage 900mV @ 250µA
Max Gate Charge at Vgs 8 nC @ 8 V
Maximum Gate Voltage ±8V
Max Input Cap at Vds 245 pF @ 10 V
Transistor Special Function -
Max Heat Dissipation 500mW (Ta)
Ambient Temp Range -55°C ~ 150°C (TJ)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Vendor Package Type 4-Microfoot
Component Housing Style 4-XFBGA

Description

Supports a continuous drain current (Id) of 2.1A (Ta) at 25°C. Supports Vdss drain-to-source voltage rated at 20 V. Accommodates drive voltage specified at 1.5V, 4.5V for RdsOn regulation. Accommodates FET classification identified as N-Channel. Guarantees maximum 8 nC @ 8 V gate charge at Vgs for enhanced switching efficiency. Upholds 8 nC @ 8 V gate charge at Vgs for reliable MOSFET functionality. The highest input capacitance is 245 pF @ 10 V at Vds for safeguarding the device. The input capacitance is rated at 245 pF @ 10 V at Vds for optimal performance. Mounting style Surface Mount for structural integrity. Operating temperature -55°C ~ 150°C (TJ) for thermal stability. Enclosure Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for component protection or transport. Enclosure/case 4-XFBGA providing mechanical and thermal shielding. Enclosure type 4-Microfoot ensuring device integrity. Highest power dissipation 500mW (Ta) for effective thermal control. Product condition Active for availability and lifecycle. Peak Rds(on) at Id 8 nC @ 8 V for MOSFET efficiency. Peak Rds(on) at Id and Vgs 72mOhm @ 1A, 4.5V for MOSFET criteria. Product or component classification series TrenchFET®. Manufacturer package type 4-Microfoot for component choice. Platform technology MOSFET (Metal Oxide) for the type of product. Peak Vgs ±8V for MOSFET parameters. Peak Vgs(th) at Id 900mV @ 250µA for MOSFET threshold level.

Stay Up to Date

Subscribe to our newsletter to receiveour weekly feed.