Stock: 3570
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 5000 | ₹ 24.92 | ₹ 1,24,600.00 |
| 1000 | ₹ 27.14 | ₹ 27,140.00 |
| 500 | ₹ 28.16 | ₹ 14,080.00 |
| 300 | ₹ 28.94 | ₹ 8,682.00 |
| 100 | ₹ 30.67 | ₹ 3,067.00 |
| 50 | ₹ 31.82 | ₹ 1,591.00 |
| 25 | ₹ 33.00 | ₹ 825.00 |
| 10 | ₹ 34.69 | ₹ 346.90 |
| 1 | ₹ 39.24 | ₹ 39.24 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Hi-Flow® 115-AC | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | TO-220 | |
| Device Type Classification | Pad, Sheet | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 19.05mm x 12.70mm | |
| Material Thickness Gauge | 0.0055" (0.140mm) | |
| Construction Material Type | Phase Change Compound | |
| Bonding Agent Type | Adhesive - One Side | |
| Support Layer Material | Fiberglass | |
| Visual Hue | Gray | |
| Material Heat Resistance | 0.35°C/W | |
| Heat Transfer Coefficient | 0.8W/m-K |
Description
Uses Adhesive - One Side adhesive for durable bonding. Made with Fiberglass backing/carrier materials for longevity. Available in a color identified as Gray to enhance system aesthetics. Material type Phase Change Compound for reliability and performance. Contour 19.05mm x 12.70mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series Hi-Flow® 115-AC. Form Rectangular for device or component. Thermal conductivity value 0.8W/m-K for heat transfer efficiency. Thermal resistivity value 0.35°C/W for insulation or material effectiveness. Thickness measurement 0.0055" (0.140mm) for material or component size. Category Pad, Sheet for classification or specification. Application TO-220 for intended use or function.
