Home Products Cooling Fans Heat Sinks And Thermal Solutions Thermal Pads T Global Technology Cp23 To220 21 5 11 4 5 8 0 45
Attribute
Description
Manufacturer Part Number
CP23-TO220-21.5-11.4-5.8-0.45
Manufacturer
Description
THERM PAD 21.5MMX11.4MMX5.8MM
Note :
GST will not be applied to orders shipping outside of India
Stock: 18646
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 5000 | ₹ 27.23 | ₹ 1,36,150.00 |
| 1000 | ₹ 29.66 | ₹ 29,660.00 |
| 500 | ₹ 30.78 | ₹ 15,390.00 |
| 250 | ₹ 31.93 | ₹ 7,982.50 |
| 100 | ₹ 33.52 | ₹ 3,352.00 |
| 50 | ₹ 34.78 | ₹ 1,739.00 |
| 25 | ₹ 36.06 | ₹ 901.50 |
| 10 | ₹ 37.90 | ₹ 379.00 |
| 1 | ₹ 42.81 | ₹ 42.81 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | THINC | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Intended Usage Scenario | TO-220 | |
| Device Type Classification | Interface Cap | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 21.50mm x 11.40mm x 5.80mm | |
| Material Thickness Gauge | 0.0177" (0.450mm) | |
| Construction Material Type | Silicone | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | Gray | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 1.9W/m-K |
Description
Available in a color identified as Gray to enhance system aesthetics. Material type Silicone for reliability and performance. Contour 21.50mm x 11.40mm x 5.80mm for device shape and footprint. Enclosure Box for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series THINC. Form Rectangular for device or component. Thermal conductivity value 1.9W/m-K for heat transfer efficiency. Thickness measurement 0.0177" (0.450mm) for material or component size. Category Interface Cap for classification or specification. Application TO-220 for intended use or function.
