Attribute
Description
Manufacturer Part Number
A18213-14
Manufacturer
Description
THERM PAD 229MMX229MM GRAY
Note :
GST will not be applied to orders shipping outside of India
Stock: 40
Distributor: 116
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 40 | ₹ 34,059.80 | ₹ 13,62,392.00 |
| 20 | ₹ 34,237.20 | ₹ 6,84,744.00 |
| 10 | ₹ 35,698.75 | ₹ 3,56,987.50 |
| 6 | ₹ 35,882.76 | ₹ 2,15,296.56 |
| 4 | ₹ 36,066.78 | ₹ 1,44,267.12 |
Stock: 4
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 4 | ₹ 36,877.71 | ₹ 1,47,510.84 |
Stock: 13
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 40,372.18 | ₹ 40,372.18 |
| 10 | ₹ 37,539.31 | ₹ 3,75,393.10 |
Stock: 2
Distributor: 114
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2 | ₹ 40,546.62 | ₹ 81,093.24 |
| 5 | ₹ 38,704.32 | ₹ 1,93,521.60 |
| 10 | ₹ 37,021.33 | ₹ 3,70,213.30 |
| 25 | ₹ 35,478.96 | ₹ 8,86,974.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Tflex™ SF10 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | - | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | Square | |
| Dimensional Outline Drawing | 229.00mm x 229.00mm | |
| Material Thickness Gauge | 0.138" (3.50mm) | |
| Construction Material Type | Non-Silicone, Ceramic Filled | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | Gray | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 10W/m-K |
Description
Available in a color identified as Gray to enhance system aesthetics. Material type Non-Silicone, Ceramic Filled for reliability and performance. Contour 229.00mm x 229.00mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series Tflex™ SF10. Form Square for device or component. Thermal conductivity value 10W/m-K for heat transfer efficiency. Thickness measurement 0.138" (3.50mm) for material or component size. Category Gap Filler Pad, Sheet for classification or specification.
