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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Bond-Ply® 660B | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | - | |
| Device Type Classification | Sheet, Tape | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 304.80mm x 279.40mm | |
| Material Thickness Gauge | 0.0055" (0.140mm) | |
| Construction Material Type | Non-Silicone, Polyethylene-Naphthalate (PEN) | |
| Bonding Agent Type | Adhesive - Both Sides | |
| Support Layer Material | Polyethylene-Naphthalate (PEN) | |
| Visual Hue | White | |
| Material Heat Resistance | 0.58°C/W | |
| Heat Transfer Coefficient | 0.4W/m-K |
Description
Uses Adhesive - Both Sides adhesive for durable bonding. Made with Polyethylene-Naphthalate (PEN) backing/carrier materials for longevity. Available in a color identified as White to enhance system aesthetics. Material type Non-Silicone, Polyethylene-Naphthalate (PEN) for reliability and performance. Contour 304.80mm x 279.40mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series Bond-Ply® 660B. Form Rectangular for device or component. Thermal conductivity value 0.4W/m-K for heat transfer efficiency. Thermal resistivity value 0.58°C/W for insulation or material effectiveness. Thickness measurement 0.0055" (0.140mm) for material or component size. Category Sheet, Tape for classification or specification.
