Attribute
Description
Manufacturer Part Number
WG-70S20020005
Manufacturer
Description
Silicone Thermal Filler Pad
Manufacturer Lead Time
Not specified
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | WG-S | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | Multi | |
| Device Type Classification | Thermal Pad | |
| Physical Shape Form | Square | |
| Dimensional Outline Drawing | 200.00mm x 200.00mm | |
| Material Thickness Gauge | 0.020" (0.50mm) | |
| Construction Material Type | Silicone | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | Gray | |
| Material Heat Resistance | 0.29°C/W | |
| Heat Transfer Coefficient | 7.0W/m-K |
Description
Available in a color identified as Gray to enhance system aesthetics. Material type Silicone for reliability and performance. Contour 200.00mm x 200.00mm for device shape and footprint. Enclosure Bulk for component protection or transport. Product condition Active for availability and lifecycle. Product or component classification series WG-S. Form Square for device or component. Thermal conductivity value 7.0W/m-K for heat transfer efficiency. Thermal resistivity value 0.29°C/W for insulation or material effectiveness. Thickness measurement 0.020" (0.50mm) for material or component size. Category Thermal Pad for classification or specification. Application Multi for intended use or function.
