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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 2011 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Top Mount with Fan | |
| Thermal Package Design | Intel LGA2011 2U Active CPU Cooler | |
| Mounting Technique | Push Pin | |
| Physical Shape Form | Rectangular, Fins | |
| Linear Length Dimension | 4.085" (103.75mm) | |
| Horizontal Width Dimension | 3.020" (76.70mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 2.717" (69.00mm) | |
| Power at Temp Increase | 145.0W @ 26°C | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | 0.18°C/W | |
| Construction Material Type | Aluminum, Copper | |
| Surface Material Treatment | - |
Description
Secured using a Push Pin approach for stable positioning. Has fin height recorded at 2.717" (69.00mm). Total length 4.085" (103.75mm) for size reference. Material type Aluminum, Copper for reliability and performance. Enclosure Bulk for component protection or transport. Thermal management package Intel LGA2011 2U Active CPU Cooler for cooling purposes. Power dissipation at elevated temperature 145.0W @ 26°C for device durability. Product condition Active for availability and lifecycle. Product or component classification series 2011. Form Rectangular, Fins for device or component. Thermal resistance during natural convection 0.18°C/W for heat release. Category Top Mount with Fan for classification or specification. Horizontal dimension width 3.020" (76.70mm).
