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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | Board Level, Vertical | |
| Thermal Package Design | TO-220 | |
| Mounting Technique | Bolt On and PC Pin | |
| Physical Shape Form | Rectangular, Fins | |
| Linear Length Dimension | 0.750" (19.05mm) | |
| Horizontal Width Dimension | 0.835" (21.21mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.394" (10.00mm) | |
| Power at Temp Increase | 3.0W @ 60°C | |
| Thermal Resistance with Fan | 12.00°C/W @ 200 LFM | |
| Passive Cooling Resistance | - | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Secured using a Bolt On and PC Pin approach for stable positioning. Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Has fin height recorded at 0.394" (10.00mm). Total length 0.750" (19.05mm) for size reference. Material type Aluminum for reliability and performance. Finish Black Anodized for both protection and visual appeal. Enclosure Bulk for component protection or transport. Thermal management package TO-220 for cooling purposes. Power dissipation at elevated temperature 3.0W @ 60°C for device durability. Product condition Obsolete for availability and lifecycle. Form Rectangular, Fins for device or component. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. Thermal resistance under forced airflow 12.00°C/W @ 200 LFM for cooling effectiveness. Category Board Level, Vertical for classification or specification. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters. Horizontal dimension width 0.835" (21.21mm).
