831502B03900

831502B03900
Attribute
Description
Manufacturer Part Number
831502B03900
Manufacturer
Description
HEATSINK STAMP 19X12.8X12.7MM
Manufacturer Lead Time
Not specified

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Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Obsolete
Device Type Classification Board Level, Vertical
Thermal Package Design TO-220, TO-262
Mounting Technique Clip and PC Pin
Physical Shape Form Rectangular, Fins
Linear Length Dimension 0.750" (19.05mm)
Horizontal Width Dimension 0.504" (12.80mm)
Circular Measurement -
Heat Sink Fin Elevation 0.500" (12.70mm)
Power at Temp Increase 1.0W @ 30°C
Thermal Resistance with Fan 7.00°C/W @ 400 LFM
Passive Cooling Resistance -
Construction Material Type Aluminum
Surface Material Treatment Black Anodized

Description

Secured using a Clip and PC Pin approach for stable positioning. Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Has fin height recorded at 0.500" (12.70mm). Total length 0.750" (19.05mm) for size reference. Material type Aluminum for reliability and performance. Finish Black Anodized for both protection and visual appeal. Enclosure Bulk for component protection or transport. Thermal management package TO-220, TO-262 for cooling purposes. Power dissipation at elevated temperature 1.0W @ 30°C for device durability. Product condition Obsolete for availability and lifecycle. Form Rectangular, Fins for device or component. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. Thermal resistance under forced airflow 7.00°C/W @ 400 LFM for cooling effectiveness. Category Board Level, Vertical for classification or specification. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters. Horizontal dimension width 0.504" (12.80mm).

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