821102B00000

821102B00000
Attribute
Description
Manufacturer Part Number
821102B00000
Manufacturer
Description
HEATSINK STAMP 9.5X13.2X19.1MM
Manufacturer Lead Time
Not specified

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Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Obsolete
Device Type Classification Board Level
Thermal Package Design TO-220
Mounting Technique Bolt On
Physical Shape Form Rectangular, Fins
Linear Length Dimension 0.750" (19.05mm)
Horizontal Width Dimension 0.520" (13.21mm)
Circular Measurement -
Heat Sink Fin Elevation 0.375" (9.52mm)
Power at Temp Increase 1.0W @ 30°C
Thermal Resistance with Fan 12.00°C/W @ 200 LFM
Passive Cooling Resistance -
Construction Material Type Aluminum
Surface Material Treatment Black Anodized

Description

Secured using a Bolt On approach for stable positioning. Measures resistance at forward current Tariff may apply if shipping to the United States for LED or diode evaluation. Has fin height recorded at 0.375" (9.52mm). Total length 0.750" (19.05mm) for size reference. Material type Aluminum for reliability and performance. Finish Black Anodized for both protection and visual appeal. Enclosure Bulk for component protection or transport. Thermal management package TO-220 for cooling purposes. Power dissipation at elevated temperature 1.0W @ 30°C for device durability. Product condition Obsolete for availability and lifecycle. Form Rectangular, Fins for device or component. Classification for tariffs Tariff may apply if shipping to the United States regarding import/export. Thermal resistance under forced airflow 12.00°C/W @ 200 LFM for cooling effectiveness. Category Board Level for classification or specification. Peak Vce(on) at Vge Tariff may apply if shipping to the United States for transistor parameters. Horizontal dimension width 0.520" (13.21mm).

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