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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Device Type Classification | Top Mount, Skived | |
| Thermal Package Design | BGA | |
| Mounting Technique | Push Pin | |
| Physical Shape Form | Square, Fins | |
| Linear Length Dimension | 3.150" (80.00mm) | |
| Horizontal Width Dimension | 3.150" (80.00mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.472" (12.00mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | 1.20°C/W @ 200 LFM | |
| Passive Cooling Resistance | 5.10°C/W | |
| Construction Material Type | Copper | |
| Surface Material Treatment | AavSHIELD 3C |
Description
Secured using a Push Pin approach for stable positioning. Has fin height recorded at 0.472" (12.00mm). Total length 3.150" (80.00mm) for size reference. Material type Copper for reliability and performance. Finish AavSHIELD 3C for both protection and visual appeal. Enclosure Tray for component protection or transport. Thermal management package BGA for cooling purposes. Product condition Active for availability and lifecycle. Form Square, Fins for device or component. Thermal resistance under forced airflow 1.20°C/W @ 200 LFM for cooling effectiveness. Thermal resistance during natural convection 5.10°C/W for heat release. Category Top Mount, Skived for classification or specification. Horizontal dimension width 3.150" (80.00mm).
