T502C475M035AG6110

T502C475M035AG6110
Attribute
Description
Manufacturer Part Number
T502C475M035AG6110
Manufacturer
Description
CAP TANT 4.7UF 20% 35V 2312
Manufacturer Lead Time
50 weeks

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line T502
IC Encapsulation Type Tape & Reel (TR)
Availability Status Active
Storage Capacity Electrical 4.7 µF
Accuracy Tolerance Percentage ±20%
Rated Operating Voltage 35 V
Device Type Classification Molded
Series Resistance Equivalent 2Ohm @ 100kHz
Ambient Temp Range -55°C ~ 230°C
Expected Life at Temperature 500 Hrs @ 230°C
Attachment Mounting Style Surface Mount
Component Housing Style 2312 (6032 Metric)
Package Size Specs 0.236" L x 0.126" W (6.00mm x 3.20mm)
Maximum Mounted Height 0.110" (2.80mm)
Pin Lead Gap -
Vendor Dimension Code C
Performance Rating Specs -
Key Product Highlights High Temperature
Reliability Failure Metric -
Quality Grade Level -
Certification Qualification -

Description

Offers a capacitance level rated at 4.7 µF to ensure circuit stability. Offers ESR rated at 2Ohm @ 100kHz. Furnished with features classified as High Temperature. Maximum seated height of 0.110" (2.80mm) for components mounted on the board. Functions with a lifespan of 500 Hrs @ 230°C at designated temperature. Vendor size code C for compatibility and reference. Mounting style Surface Mount for structural integrity. Operating temperature -55°C ~ 230°C for thermal stability. Enclosure Tape & Reel (TR) for component protection or transport. Enclosure/case 2312 (6032 Metric) providing mechanical and thermal shielding. Product condition Active for availability and lifecycle. Product or component classification series T502. Dimensions 0.236" L x 0.126" W (6.00mm x 3.20mm) for mechanical or electrical components. Dimension measurement 0.236" L x 0.126" W (6.00mm x 3.20mm) for component details. Tolerance ±20% for precision in manufacturing. Category Molded for classification or specification. Operating voltage rating 35 V for device specifications.

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