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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | T330 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Storage Capacity Electrical | 3.3 µF | |
| Accuracy Tolerance Percentage | ±20% | |
| Rated Operating Voltage | 25 V | |
| Device Type Classification | Molded | |
| Series Resistance Equivalent | 5Ohm @ 100kHz | |
| Ambient Temp Range | -55°C ~ 125°C | |
| Expected Life at Temperature | - | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | Radial | |
| Package Size Specs | 0.230" L x 0.105" W (5.84mm x 2.67mm) | |
| Maximum Mounted Height | 0.353" (8.96mm) | |
| Pin Lead Gap | 0.125" (3.18mm) | |
| Vendor Dimension Code | A | |
| Performance Rating Specs | - | |
| Key Product Highlights | General Purpose | |
| Reliability Failure Metric | - | |
| Quality Grade Level | - | |
| Certification Qualification | - |
Description
Offers a capacitance level rated at 3.3 µF to ensure circuit stability. Offers ESR rated at 5Ohm @ 100kHz. Furnished with features classified as General Purpose. Maximum seated height of 0.353" (8.96mm) for components mounted on the board. Lead spacing 0.125" (3.18mm) for compliance with PCB design. Vendor size code A for compatibility and reference. Mounting style Through Hole for structural integrity. Operating temperature -55°C ~ 125°C for thermal stability. Enclosure Bulk for component protection or transport. Enclosure/case Radial providing mechanical and thermal shielding. Product condition Active for availability and lifecycle. Product or component classification series T330. Dimensions 0.230" L x 0.105" W (5.84mm x 2.67mm) for mechanical or electrical components. Dimension measurement 0.230" L x 0.105" W (5.84mm x 2.67mm) for component details. Tolerance ±20% for precision in manufacturing. Category Molded for classification or specification. Operating voltage rating 25 V for device specifications.
