Stock: 860
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 500 | ₹ 358.28 | ₹ 1,79,140.00 |
| 100 | ₹ 406.89 | ₹ 40,689.00 |
| 50 | ₹ 435.20 | ₹ 21,760.00 |
| 10 | ₹ 525.11 | ₹ 5,251.10 |
| 1 | ₹ 742.68 | ₹ 742.68 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 196 DLC | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Storage Capacity Electrical | 100 mF | |
| Accuracy Tolerance Percentage | -20%, +80% | |
| Rated Operating Voltage | 5.5 V | |
| Series Resistance Equivalent | 200Ohm | |
| Expected Life at Temperature | 1000 Hrs @ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Circuit End Method | PC Pins | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | Radial, Can | |
| Pin Lead Gap | 0.197" (5.00mm) | |
| Package Size Specs | 0.512" Dia (13.00mm) | |
| Maximum Mounted Height | 0.374" (9.50mm) | |
| Ambient Temp Range | -25°C ~ 85°C |
Description
Offers a capacitance level rated at 100 mF to ensure circuit stability. Offers ESR rated at 200Ohm. Maximum seated height of 0.374" (9.50mm) for components mounted on the board. Lead spacing 0.197" (5.00mm) for compliance with PCB design. Functions with a lifespan of 1000 Hrs @ 85°C at designated temperature. Mounting style Through Hole for structural integrity. Operating temperature -25°C ~ 85°C for thermal stability. Enclosure Bulk for component protection or transport. Enclosure/case Radial, Can providing mechanical and thermal shielding. Product condition Obsolete for availability and lifecycle. Product or component classification series 196 DLC. Dimensions 0.512" Dia (13.00mm) for mechanical or electrical components. Dimension measurement 0.512" Dia (13.00mm) for component details. Termination method PC Pins for electrical or mechanical linkage. Tolerance -20%, +80% for precision in manufacturing. Operating voltage rating 5.5 V for device specifications.
