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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | XMPL | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Polymer | |
| Storage Capacity Electrical | 68 µF | |
| Accuracy Tolerance Percentage | ±20% | |
| Rated Operating Voltage | 10 V | |
| Series Resistance Equivalent | 40mOhm | |
| Expected Life at Temperature | 1000 Hrs @ 105°C | |
| Ambient Temp Range | -40°C ~ 105°C | |
| Performance Rating Specs | - | |
| Intended Uses | Decoupling | |
| Key Product Highlights | - | |
| Low-Freq Ripple Amps | - | |
| High-Freq Ripple Amps | 3 A @ 100 kHz | |
| AC Resistance Value | - | |
| Pin Lead Gap | - | |
| Package Size Specs | 0.287" L x 0.169" W (7.30mm x 4.30mm) | |
| Maximum Mounted Height | 0.118" (3.00mm) | |
| SMD Pad Footprint | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 2917 (7343 Metric) |
Description
Ideally suited for scenarios involving Decoupling. Offers a capacitance level rated at 68 µF to ensure circuit stability. Offers ESR rated at 40mOhm. Maximum seated height of 0.118" (3.00mm) for components mounted on the board. Functions with a lifespan of 1000 Hrs @ 105°C at designated temperature. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 105°C for thermal stability. Enclosure Bulk for component protection or transport. Enclosure/case 2917 (7343 Metric) providing mechanical and thermal shielding. Product condition Active for availability and lifecycle. High-frequency ripple current 3 A @ 100 kHz for efficiency. Product or component classification series XMPL. Dimensions 0.287" L x 0.169" W (7.30mm x 4.30mm) for mechanical or electrical components. Dimension measurement 0.287" L x 0.169" W (7.30mm x 4.30mm) for component details. Tolerance ±20% for precision in manufacturing. Category Polymer for classification or specification. Operating voltage rating 10 V for device specifications.
