Stock: 10000
Distributor: 11
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10000 | ₹ 0.21 | ₹ 2,100.00 |
Stock: 1
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 8.90 | ₹ 8.90 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | MCF | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Active | |
| Storage Capacity Electrical | 0.1 µF | |
| Accuracy Tolerance Percentage | ±10% | |
| Rated Operating Voltage | 16V | |
| Temp Drift Factor | X7R | |
| Ambient Temp Range | -55°C ~ 125°C | |
| Key Product Highlights | - | |
| Performance Rating Specs | - | |
| Intended Uses | General Purpose | |
| Reliability Failure Metric | - | |
| Attachment Mounting Style | Surface Mount, MLCC | |
| Component Housing Style | 0402 (1005 Metric) | |
| Package Size Specs | 0.039" L x 0.020" W (1.00mm x 0.50mm) | |
| Maximum Mounted Height | - | |
| Maximum Thickness Limit | 0.022" (0.55mm) | |
| Pin Lead Gap | - | |
| Wire Lead Configuration | - |
Description
Ideally suited for scenarios involving General Purpose. Offers a capacitance level rated at 0.1 µF to ensure circuit stability. Mounting style Surface Mount, MLCC for structural integrity. Operating temperature -55°C ~ 125°C for thermal stability. Enclosure Tape & Reel (TR) for component protection or transport. Enclosure/case 0402 (1005 Metric) providing mechanical and thermal shielding. Product condition Active for availability and lifecycle. Product or component classification series MCF. Dimensions 0.039" L x 0.020" W (1.00mm x 0.50mm) for mechanical or electrical components. Dimension measurement 0.039" L x 0.020" W (1.00mm x 0.50mm) for component details. Coefficient of temperature X7R for stability in performance. Maximum allowable thickness 0.022" (0.55mm) for specification limits. Tolerance ±10% for precision in manufacturing. Operating voltage rating 16V for device specifications.
