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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | PME271E | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Storage Capacity Electrical | 0.15 µF | |
| Accuracy Tolerance Percentage | ±10% | |
| AC Voltage Max | 300V | |
| DC Voltage Max | - | |
| Insulating Dielectric Type | Paper, Metallized | |
| Series Resistance Equivalent | - | |
| Ambient Temp Range | -40°C ~ 110°C | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | Radial | |
| Package Size Specs | 1.063" L x 0.394" W (27.00mm x 10.00mm) | |
| Maximum Mounted Height | 0.748" (19.00mm) | |
| Circuit End Method | PC Pins | |
| Pin Lead Gap | 0.886" (22.50mm) | |
| Intended Uses | EMI, RFI Suppression | |
| Performance Rating Specs | X1 | |
| Key Product Highlights | - |
Description
Ideally suited for scenarios involving EMI, RFI Suppression. Offers a capacitance level rated at 0.15 µF to ensure circuit stability. Made with dielectric material identified as Paper, Metallized. Maximum seated height of 0.748" (19.00mm) for components mounted on the board. Lead spacing 0.886" (22.50mm) for compliance with PCB design. Mounting style Through Hole for structural integrity. Operating temperature -40°C ~ 110°C for thermal stability. Enclosure Bulk for component protection or transport. Enclosure/case Radial providing mechanical and thermal shielding. Product condition Obsolete for availability and lifecycle. Specifications X1 for electrical, mechanical, or environmental performance. Product or component classification series PME271E. Dimensions 1.063" L x 0.394" W (27.00mm x 10.00mm) for mechanical or electrical components. Dimension measurement 1.063" L x 0.394" W (27.00mm x 10.00mm) for component details. Termination method PC Pins for electrical or mechanical linkage. Tolerance ±10% for precision in manufacturing. Maximum AC voltage rating 300V for device specifications.
