Stock: 3
Distributor: 122
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10 | ₹ 124.16 | ₹ 1,241.60 |
| 1 | ₹ 125.22 | ₹ 125.22 |
Stock: 114
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 1,859.21 | ₹ 1,859.21 |
| 10 | ₹ 1,103.60 | ₹ 11,036.00 |
| 100 | ₹ 937.17 | ₹ 93,717.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | CS201 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Storage Capacity Electrical | 10000pF | |
| Accuracy Tolerance Percentage | ±10% | |
| Rated Operating Voltage | 50 V | |
| Insulating Dielectric Type | Thick Film | |
| Capacitor Component Count | 7 | |
| Circuit Configuration Style | Bussed | |
| Temp Drift Factor | X7R | |
| Performance Rating Specs | - | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | 10-SIP | |
| Vendor Package Type | - | |
| Package Size Specs | 1.000" L x 0.135" W (25.40mm x 3.43mm) | |
| Maximum Mounted Height | 0.307" (7.80mm) |
Description
Offers a capacitance level rated at 10000pF to ensure circuit stability. Utilizes a circuit type categorized as Bussed. Made with dielectric material identified as Thick Film. Maximum seated height of 0.307" (7.80mm) for components mounted on the board. Mounting style Through Hole for structural integrity. Total capacitors 7 for circuit design. Enclosure Bulk for component protection or transport. Enclosure/case 10-SIP providing mechanical and thermal shielding. Product condition Active for availability and lifecycle. Product or component classification series CS201. Dimensions 1.000" L x 0.135" W (25.40mm x 3.43mm) for mechanical or electrical components. Dimension measurement 1.000" L x 0.135" W (25.40mm x 3.43mm) for component details. Coefficient of temperature X7R for stability in performance. Tolerance ±10% for precision in manufacturing. Operating voltage rating 50 V for device specifications.
