90621-AS

90621-AS
Attribute
Description
Manufacturer Part Number
90621-AS
Manufacturer
Description
CONTACT SPRING LOADED T/H GOLD
Manufacturer Lead Time
Not specified

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Pin Interface Category Sleeve & Plunger (Pogo Pins)
Attachment Mounting Style Through Hole
Top Operational Elevation 0.205" (5.21mm)
Optimal Use Elevation -
Lowest Operational Elevation 0.150" (3.81mm)
Solder Pad Size Circular - 0.078" (1.98mm)
Starting Actuation Force 45.89gf
Mid-Stroke Force 96.87gf
Actuator Plunger Dimension 0.042" (1.07mm) Dia
Key Product Highlights -
Connection Durability Cycles 40000
Pin Alloy Composition Beryllium Copper
Pin Surface Treatment Gold
Pin Coating Depth 20.0µin (0.51µm)
Ampere Capacity Rating -

Description

Includes contact finish plated at Gold to enhance conductivity. Presents contact finish thickness recorded at 20.0µin (0.51µm). Made with contact material rated as Beryllium Copper. Utilizes a contact type identified as Sleeve & Plunger (Pogo Pins). Supports high-level output current indicated as 0.150" (3.81mm). Supports 40000 mating cycles to ensure long-lasting reliability. Highest operational altitude 0.205" (5.21mm) for safety during use. Minimum operational height 0.150" (3.81mm) for safety and comfort. Mounting style Through Hole for structural integrity. Initial force 45.89gf for precise actuation. Intermediate compression force 96.87gf for reliable performance. Enclosure Bulk for component protection or transport. Pad dimensions Circular - 0.078" (1.98mm) for PCB layout. Size 0.042" (1.07mm) Dia of the plunger for mechanical operation. Product condition Active for availability and lifecycle.

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