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Abracon Corp
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Products
Board To Board Wire To Board Connectors
Socket Adapter Converters
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Datasheet
4
Results
Manufacturer
1
3M
ANALOG DEVICES INC./MAXIM INTE...
ARIES ELECTRONICS
LOGICAL SYSTEMS INC
MIKROELEKTRONIKA
TE CONNECTIVITY DEUTSCH CONNEC...
XELTEK INC
Product Series Line
0
*
647
Correct-A-Chip®
Correct-A-Chip® 1106396
Correct-A-Chip® 1107254
Correct-A-Chip® 1109342
Correct-A-Chip® 1109522
Correct-A-Chip® 1109523
Correct-A-Chip® 1110087
Correct-A-Chip® 1110267-N
Correct-A-Chip® 1111163
Correct-A-Chip® 1111841
Correct-A-Chip® 1111903
Correct-A-Chip® 301296
Correct-A-Chip® 301550
Correct-A-Chip® 304235
Correct-A-Chip® 304504
Correct-A-Chip® 304538
Correct-A-Chip® 305263
Correct-A-Chip® 305479
Correct-A-Chip® 307349
Correct-A-Chip® 350000
Correct-A-Chip® 351000
Correct-A-Chip® 352000
Correct-A-Chip® 353000
Correct-A-Chip® 354000
Correct-A-Chip® 354W00
Correct-A-Chip® 35W000
Correct-A-Chip® 450001
Correct-A-Chip® 505
Correct-A-Chip® 555000
Correct-A-Chip® 650000
Correct-A-Chip® 651000
Correct-A-Chip® 652000
Correct-A-Chip® 653000
Correct-A-Chip® 655000
Correct-A-Chip® 6645
Correct-A-Chip® 665000
Correct-A-Chip® 666000
Correct-A-Chip® 95-132I25
Correct-A-Chip® 96-160M65
Correct-A-Chip® 96-208M50
Correct-A-Chip® 97-56001
Correct-A-Chip® 97-68340
Correct-A-Chip® 97-AQ132D
DS9075
DX
Textool™
-
IC Encapsulation Type
0
Bag
Box
BoxBox
Bulk
Retail Package
Tube
-
Availability Status
0
Active
Discontinued at Digi-Key
Obsolete
Source Adapter Interface
0
AT90PWM2
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacin...
DIP, 0.4" (10.16mm) Row Spacin...
DIP, 0.9" (22.86mm) Row Spacin...
DIP, 0.8" (20.32mm) Row Spacin...
DIP, 1.0" (25.40mm) Row Spacin...
HB2E Relay
MSOP
Multiple Packages
PLCC
PQFP
QFP
SIP
Socket, 0.6" (15.24mm) Row Spa...
SOIC
SOIC-W
SOJ
SOWIC
SSOP
TQFP
TSOP
VQFP
-
Target Adapter Interface
0
DIP
DIP, 0.6" (15.24mm) Row Spacin...
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.4" (10.16mm) Row Spacin...
DIP, 0.9" (22.86mm) Row Spacin...
DIP, 0.8" (20.32mm) Row Spacin...
DIP, 1.0" (25.40mm) Row Spacin...
JEDEC
PGA
PLCC
QFP
SOIC
SOWIC
-
IC Pin Total
0
10
100
12
128
132
14
144
16
160
169
18
184
20
208
22
24
28
32
36
40
42
44
48
52
56
60
64
68
8
80
84
90
-
Mating Connector Pitch
0
0.020" (0.50mm)
0.024" (0.60mm)
0.025" (0.64mm)
0.026" (0.65mm)
0.031" (0.80mm)
0.050" (1.27mm)
0.070" (1.78mm)
0.100" (2.54mm)
-
Engaging Pin Coating
0
Gold
Silver
Tin
Tin-Lead
-
Attachment Mounting Style
0
Surface Mount
Through Hole
-
Circuit End Method
0
Solder
Wire Wrap
-
Post Pin Interval
0
0.031" (0.80mm)
0.050" (1.27mm)
0.070" (1.78mm)
0.075" (1.91mm)
0.100" (2.54mm)
-
Post-Contact Pin Layer
0
Gold
Tin
Tin-Lead
-
Casing Build Material
0
Polyamide (PA46), Nylon 4/6, G...
Polyester
Polysulfone (PSU), Glass Fille...
Polyphenylene Sulfide (PPS)
-
Circuit Board Substrate
0
FR4 Epoxy Glass
-
Clear Filters
Manufacturer
LOGICAL SYSTEMS
Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Source Adapter Interface
Target Adapter Interface
IC Pin Total
Mating Connector Pitch
Engaging Pin Coating
Attachment Mounting Style
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Casing Build Material
Circuit Board Substrate
PA-SOD6SM18-40
LOGICAL SYSTEMS
LOGICAL SYSTEMS
₹1,779.20
-
Bulk
Active
SOIC
DIP, 0.6" (15.24mm) Row Spacing
40
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
PA-TS1D6SM18-40
LOGICAL SYSTEMS
LOGICAL SYSTEMS
₹1,779.20
-
Bulk
Active
TSOP
DIP
40
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
PA-SOD6SM18-44
LOGICAL SYSTEMS
LOGICAL SYSTEMS
₹1,957.12
-
Bulk
Active
SOIC
DIP
44
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
PA-TS1D6SM18-56
LOGICAL SYSTEMS
LOGICAL SYSTEMS
₹2,490.88
-
Bulk
Active
TSOP
DIP
56
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Source Adapter Interface
Target Adapter Interface
IC Pin Total
Mating Connector Pitch
Engaging Pin Coating
Attachment Mounting Style
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Casing Build Material
Circuit Board Substrate
MANUFACTURERS:
3 Y POWER TECHNOLOGY
|
3D SYSTEMS INC
|
3D PLUS
|
3E SECURITY
|
ACTION TUNGSRAM INC
|
ACP OPTOELECTRONIC TECHNOLOGY CO LTD
|
ACME ELECTRIC CORP
|
ACCUTEK MICROCIRCUIT CORP
|
ADVANCED CERAMIC X CORP
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