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IC Encapsulation Type0

Availability Status0

Source Adapter Interface0

Target Adapter Interface0

IC Pin Total0

Mating Connector Pitch0

Engaging Pin Coating0

Attachment Mounting Style0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Casing Build Material0

Circuit Board Substrate0

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Source Adapter Interface
Target Adapter Interface
IC Pin Total
Mating Connector Pitch
Engaging Pin Coating
Attachment Mounting Style
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Casing Build Material
Circuit Board Substrate
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228-1277-09-0602J 3M
3M
₹3,550.66
Textool™
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
224-1275-29-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,417.23
Textool™
Box
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
248-1282-29-0602J 3M INTERCONNECT
3M INTERCONNECT
₹2,411.35
Textool™
Box
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
48
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
240-1280-19-0602J 3M INTERCONNECT
3M INTERCONNECT
₹2,927.79
Textool™
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
216-3340-19-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,936.04
Textool™
Box
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
16
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
214-3339-09-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,415.69
Textool™
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
14
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
216-3340-09-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,493.87
Textool™
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
16
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
220-3342-09-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,563.49
Textool™
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
240-1280-29-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,715.40
Textool™
Box
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
GX5104-T005-S4 XELTEK INC
XELTEK INC
-
*
Retail Package
Active
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-
-
-
-
-
-
-
-
-
-
img
228-1277-19-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,428.11
Textool™
BoxBox
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
218-3341-19-0602J 3M INTERCONNECT
3M INTERCONNECT
₹10,603.90
Textool™
Box
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
18
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
1106396-28 ARIES ELECTRONICS INC
ARIES ELECTRONICS INC
₹1,060.88
Correct-A-Chip® 1106396
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
img
28-653000-10 ARIES ELECTRONICS INC
ARIES ELECTRONICS INC
₹2,730.52
Correct-A-Chip® 653000
Bulk
Active
PLCC
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
img
1109523 ARIES ELECTRONICS INC
ARIES ELECTRONICS INC
₹1,126.04
Correct-A-Chip® 1109523
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
JEDEC
8
0.100" (2.54mm)
Gold
Through Hole
Solder
-
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
FR4 Epoxy Glass
img
224-1275-19-0602J 3M INTERCONNECT
3M INTERCONNECT
₹2,016.65
Textool™
Box
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
232-1285-19-0602J 3M INTERCONNECT
3M INTERCONNECT
₹1,942.15
Textool™
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
32
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
img
32-653000-10 ARIES ELECTRONICS INC
ARIES ELECTRONICS INC
₹3,252.95
Correct-A-Chip® 653000
Bulk
Active
PLCC
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
img
1106396-24 ARIES ELECTRONICS INC
ARIES ELECTRONICS INC
₹1,101.55
Correct-A-Chip® 1106396
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
img
220-3342-19-0602J 3M INTERCONNECT
3M INTERCONNECT
₹2,144.91
Textool™
Box
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
20
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
...
MANUFACTURERS: 3 Y POWER TECHNOLOGY | 3D SYSTEMS INC | 3D PLUS | 3E SECURITY | ACTION TUNGSRAM INC | ACP OPTOELECTRONIC TECHNOLOGY CO LTD | ACME ELECTRIC CORP | ACCUTEK MICROCIRCUIT CORP | ADVANCED CERAMIC X CORP

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