245-08-1-03

245-08-1-03
Attribute
Description
Manufacturer Part Number
245-08-1-03
Manufacturer
Description
CONN IC DIP SOCKET 8POS TIN
Note : GST will not be applied to orders shipping outside of India

Stock:
150000

Distributor: 110

Lead Time: Not specified

Quantity Unit Price Ext. Price
150000 ₹ 9.09 ₹ 13,63,500.00
102000 ₹ 9.23 ₹ 9,41,460.00
54000 ₹ 9.37 ₹ 5,05,980.00
30000 ₹ 9.75 ₹ 2,92,500.00
12000 ₹ 10.03 ₹ 1,20,360.00
6000 ₹ 10.32 ₹ 61,920.00
2500 ₹ 10.79 ₹ 26,975.00
250 ₹ 13.69 ₹ 3,422.50

Stock:
4933

Distributor: 117

Lead Time: Not specified


Quantity Unit Price Ext. Price
2520 ₹ 12.37 ₹ 31,172.40
1020 ₹ 13.18 ₹ 13,443.60
540 ₹ 13.79 ₹ 7,446.60
300 ₹ 14.38 ₹ 4,314.00
120 ₹ 15.34 ₹ 1,840.80
60 ₹ 16.12 ₹ 967.20
25 ₹ 17.15 ₹ 428.75
10 ₹ 18.33 ₹ 183.30
1 ₹ 21.35 ₹ 21.35

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tube
Availability Status Active
Device Type Classification DIP, 0.3" (7.62mm) Row Spacing
Grid Pin Array Count 8 (2 x 4)
Mating Connector Pitch 0.100" (2.54mm)
Engaging Pin Coating Tin
Engagement Layer Thickness 60.0µin (1.52µm)
Connecting Pin Material Phosphor Bronze
Attachment Mounting Style Through Hole, Kinked Pin
Key Product Highlights Open Frame
Circuit End Method Solder
Post Pin Interval 0.100" (2.54mm)
Post-Contact Pin Layer Tin
Post Layer Depth 60.0µin (1.52µm)
Solder Tail Material Phosphor Bronze
Casing Build Material Polybutylene Terephthalate (PBT), Glass Filled
Ambient Temp Range -40°C ~ 105°C

Description

Provides connector spacing specified as 0.100" (2.54mm) for appropriate PCB arrangement. Features mating contact finish rated at Tin. Delivers post contact finish characterized by Tin. Contains mating finish thickness indicated as 60.0µin (1.52µm). Designed with post finish thickness assessed at 60.0µin (1.52µm). Employs mating contact material identified as Phosphor Bronze. Contains post contact material categorized as Phosphor Bronze. Furnished with features classified as Open Frame. Made from Polybutylene Terephthalate (PBT), Glass Filled housing material to ensure strength and dependability. Mounting style Through Hole, Kinked Pin for structural integrity. Pins or positions on grid 8 (2 x 4) for connector arrangement. Operating temperature -40°C ~ 105°C for thermal stability. Enclosure Tube for component protection or transport. Alignment pitch 0.100" (2.54mm) for connection with counterpart. Post spacing 0.100" (2.54mm) for mounting or PCB compatibility. Product condition Active for availability and lifecycle. Termination method Solder for electrical or mechanical linkage. Category DIP, 0.3" (7.62mm) Row Spacing for classification or specification.

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