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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 540 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | PLCC | |
| Grid Pin Array Count | 52 (4 x 13) | |
| Mating Connector Pitch | 0.050" (1.27mm) | |
| Engaging Pin Coating | Tin | |
| Engagement Layer Thickness | - | |
| Connecting Pin Material | Phosphor Bronze | |
| Attachment Mounting Style | Surface Mount | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.100" (2.54mm) | |
| Post-Contact Pin Layer | Tin | |
| Post Layer Depth | - | |
| Solder Tail Material | Phosphor Bronze | |
| Casing Build Material | Polyphenylene Sulfide (PPS) | |
| Ambient Temp Range | - |
Description
Provides connector spacing specified as 0.050" (1.27mm) for appropriate PCB arrangement. Features mating contact finish rated at Tin. Delivers post contact finish characterized by Tin. Employs mating contact material identified as Phosphor Bronze. Contains post contact material categorized as Phosphor Bronze. Furnished with features classified as Closed Frame. Made from Polyphenylene Sulfide (PPS) housing material to ensure strength and dependability. Mounting style Surface Mount for structural integrity. Pins or positions on grid 52 (4 x 13) for connector arrangement. Enclosure Bulk for component protection or transport. Alignment pitch 0.050" (1.27mm) for connection with counterpart. Post spacing 0.100" (2.54mm) for mounting or PCB compatibility. Product condition Obsolete for availability and lifecycle. Product or component classification series 540. Termination method Solder for electrical or mechanical linkage. Category PLCC for classification or specification.