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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Active | |
| Device Type Classification | SOIC | |
| Grid Pin Array Count | 8 (2 x 4) | |
| Mating Connector Pitch | 0.050" (1.27mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 15.0µin (0.38µm) | |
| Connecting Pin Material | Phosphor Bronze | |
| Attachment Mounting Style | Surface Mount | |
| Key Product Highlights | Board Guide, Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.050" (1.27mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | Flash | |
| Solder Tail Material | Phosphor Bronze | |
| Casing Build Material | Liquid Crystal Polymer (LCP) | |
| Ambient Temp Range | - |
Description
Provides connector spacing specified as 0.050" (1.27mm) for appropriate PCB arrangement. Features mating contact finish rated at Gold. Delivers post contact finish characterized by Gold. Contains mating finish thickness indicated as 15.0µin (0.38µm). Designed with post finish thickness assessed at Flash. Employs mating contact material identified as Phosphor Bronze. Contains post contact material categorized as Phosphor Bronze. Furnished with features classified as Board Guide, Closed Frame. Made from Liquid Crystal Polymer (LCP) housing material to ensure strength and dependability. Mounting style Surface Mount for structural integrity. Pins or positions on grid 8 (2 x 4) for connector arrangement. Enclosure Tape & Reel (TR) for component protection or transport. Alignment pitch 0.050" (1.27mm) for connection with counterpart. Post spacing 0.050" (1.27mm) for mounting or PCB compatibility. Product condition Active for availability and lifecycle. Termination method Solder for electrical or mechanical linkage. Category SOIC for classification or specification.