Stock: 169
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1000 | ₹ 368.82 | ₹ 3,68,820.00 |
| 500 | ₹ 383.85 | ₹ 1,91,925.00 |
| 250 | ₹ 400.61 | ₹ 1,00,152.50 |
| 100 | ₹ 425.78 | ₹ 42,578.00 |
| 50 | ₹ 447.40 | ₹ 22,370.00 |
| 25 | ₹ 471.59 | ₹ 11,789.75 |
| 10 | ₹ 507.98 | ₹ 5,079.80 |
| 5 | ₹ 539.37 | ₹ 2,696.85 |
| 1 | ₹ 627.84 | ₹ 627.84 |
Stock: 143
Distributor: 108
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 445.00 | ₹ 445.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | SOIC | |
| Grid Pin Array Count | 80 (2 x 40) | |
| Mating Connector Pitch | 0.050" (1.27mm) | |
| Engaging Pin Coating | Gold | |
| Engagement Layer Thickness | 39.4µin (1.00µm) | |
| Connecting Pin Material | - | |
| Attachment Mounting Style | Surface Mount | |
| Key Product Highlights | Closed Frame | |
| Circuit End Method | Solder | |
| Post Pin Interval | 0.050" (1.27mm) | |
| Post-Contact Pin Layer | Gold | |
| Post Layer Depth | 39.4µin (1.00µm) | |
| Solder Tail Material | - | |
| Casing Build Material | Polyamide (PA6T), Nylon 6T, Glass Filled | |
| Ambient Temp Range | -40°C ~ 130°C |
Description
Provides connector spacing specified as 0.050" (1.27mm) for appropriate PCB arrangement. Features mating contact finish rated at Gold. Delivers post contact finish characterized by Gold. Contains mating finish thickness indicated as 39.4µin (1.00µm). Designed with post finish thickness assessed at 39.4µin (1.00µm). Furnished with features classified as Closed Frame. Made from Polyamide (PA6T), Nylon 6T, Glass Filled housing material to ensure strength and dependability. Mounting style Surface Mount for structural integrity. Pins or positions on grid 80 (2 x 40) for connector arrangement. Operating temperature -40°C ~ 130°C for thermal stability. Enclosure Bulk for component protection or transport. Alignment pitch 0.050" (1.27mm) for connection with counterpart. Post spacing 0.050" (1.27mm) for mounting or PCB compatibility. Product condition Active for availability and lifecycle. Termination method Solder for electrical or mechanical linkage. Category SOIC for classification or specification.