Stock: 10
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10 | ₹ 739.79 | ₹ 7,397.90 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Expansion Card Category | Fits Female Edgecards | |
| Connector Polarity Type | Male | |
| Bay Row Position Total | 22 | |
| Switch Position Options | 44 | |
| Card Board Depth | 0.062" (1.57mm) | |
| Grid Row Count | 2 | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Data Readout Method | Dual | |
| Key Product Highlights | Card Extender | |
| Attachment Mounting Style | Board Edge, Straddle Mount | |
| Circuit End Method | Solder | |
| Pin Alloy Composition | Phosphor Bronze | |
| Pin Surface Treatment | Gold | |
| Pin Coating Depth | 30.0µin (0.76µm) | |
| Pin Interface Category | - | |
| Visual Hue | - | |
| Flange Design Element | Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia | |
| Ambient Temp Range | -65°C ~ 125°C |
Description
Suitable for card thickness measuring 0.062" (1.57mm). Compatible with card types identified as Fits Female Edgecards. Includes contact finish plated at Gold to enhance conductivity. Presents contact finish thickness recorded at 30.0µin (0.76µm). Made with contact material rated as Phosphor Bronze. Furnished with features classified as Card Extender. Delivers flange characteristics specified as Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia. Specified with Male gender configuration for connector interoperability. Mounting style Board Edge, Straddle Mount for structural integrity. Total positions 44 for switches or mechanical elements. Positions per bay/row 22 for structured mounting. Total rows 2 for matrix or display setup. Operating temperature -65°C ~ 125°C for thermal stability. Enclosure Tray for component protection or transport. Spacing 0.100" (2.54mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Extract Dual for evaluation or visualization. Termination method Solder for electrical or mechanical linkage.
