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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Plug Design Type | SMP | |
| Interface Connector Category | Plug, Male Pin | |
| Pin Connection Method | Solder | |
| Ground Shield Connection | Solder | |
| AC Resistance Value | 50 Ohms | |
| Attachment Mounting Style | Board Edge, End Launch | |
| Installation Mount Type | - | |
| Wire Assembly Category | - | |
| Secure Attachment Method | Snap-On | |
| Upper Frequency Limit | - | |
| Connection Port Total | 1 | |
| Key Product Highlights | Full Detent | |
| Enclosure Color Option | Gold | |
| Dust Water Resistance Rating | - | |
| Core Pin Composition | Beryllium Copper |
Description
Made with center contact material specified as Beryllium Copper. Employs a connector style identified as SMP. Incorporates a connector type labeled as Plug, Male Pin. Applies contact termination type specified as Solder. Employs fastening type identified as Snap-On. Furnished with features classified as Full Detent. Offered in Gold color for the housing to aid visual identification. Utilizes Gold type of illumination for ideal lighting. Set with 50 Ohms impedance to ensure signal integrity. Mounting style Board Edge, End Launch for structural integrity. Total ports 1 for communication or connectivity purposes. Enclosure Tray for component protection or transport. Product condition Active for availability and lifecycle. Shield connection Solder for EMI/RFI shielding.
