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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | BSTCM-1 | |
| IC Encapsulation Type | Bag | |
| Availability Status | Active | |
| Switch Position Options | 10 | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Grid Row Count | 2 | |
| Row Pin Gap | 0.100" (2.54mm) | |
| Complete Pin Dimension | 0.565" (14.351mm) | |
| Mating Post Length | 0.230" (5.842mm) | |
| Stacked Assembly Height | 0.285" (7.239mm) | |
| Solder Tail Extension | - | |
| Attachment Mounting Style | Surface Mount | |
| Circuit End Method | Solder | |
| Mating Post Pin Finish | Gold | |
| Mating Post Coating Thickness | 10.0µin (0.25µm) | |
| Visual Hue | Black |
Description
Available in a color identified as Black to enhance system aesthetics. Showcases mating post finish evaluated at Gold. Offers mating post finish thickness of 10.0µin (0.25µm). Total pin length 0.565" (14.351mm) to ensure accurate insertion. Length of the post 0.230" (5.842mm) for reliable connection. Height of the stack 0.285" (7.239mm) for effective component layering. Mounting style Surface Mount for structural integrity. Total positions 10 for switches or mechanical elements. Total rows 2 for matrix or display setup. Enclosure Bag for component protection or transport. Spacing 0.100" (2.54mm) for component arrangement or connector alignment. Product condition Active for availability and lifecycle. Row distance 0.100" (2.54mm) for connectors or PCB arrangement. Product or component classification series BSTCM-1. Termination method Solder for electrical or mechanical linkage.
