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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Plug Application Role | Daughtercard | |
| Interface Connector Category | Receptacle, Female Sockets | |
| Plug Design Type | High Density (HDC, HDI, HPC) | |
| Populated Position Count | All | |
| Component Spacing Distance | 0.100" (2.54mm) | |
| Grid Row Count | 3 | |
| Attachment Mounting Style | Through Hole, Right Angle | |
| Circuit End Method | Solder | |
| Pin Surface Treatment | Gold | |
| Pin Coating Depth | 30µin (0.76µm) | |
| Visual Hue | - |
Description
Measures resistance at forward current Receptacle, Female Sockets for LED or diode evaluation. Employs a connector style identified as High Density (HDC, HDI, HPC). Incorporates a connector type labeled as Receptacle, Female Sockets. Designed for connector functions characterized as Daughtercard. Includes contact finish plated at Gold to enhance conductivity. Presents contact finish thickness recorded at 30µin (0.76µm). Mounting style Through Hole, Right Angle for structural integrity. Loaded positions All for mechanical assembly. Total rows 3 for matrix or display setup. Spacing 0.100" (2.54mm) for component arrangement or connector alignment. Termination method Solder for electrical or mechanical linkage. Peak Vce(on) at Vge Daughtercard for transistor parameters.