Stock: 57654
Distributor: 135
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 100000 | ₹ 56.12 | ₹ 56,12,000.00 |
| 10000 | ₹ 66.99 | ₹ 6,69,900.00 |
| 1000 | ₹ 75.13 | ₹ 75,130.00 |
| 500 | ₹ 81.47 | ₹ 40,735.00 |
| 100 | ₹ 90.78 | ₹ 9,078.00 |
Stock: 57654
Distributor: 111
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 100000 | ₹ 70.16 | ₹ 70,16,000.00 |
| 10000 | ₹ 83.74 | ₹ 8,37,400.00 |
| 1000 | ₹ 93.92 | ₹ 93,920.00 |
| 500 | ₹ 101.84 | ₹ 50,920.00 |
| 295 | ₹ 113.47 | ₹ 33,473.65 |
Stock: 57654
Distributor: 117
Lead Time: Not specified
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 235 | ₹ 113.26 | ₹ 26,616.10 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Wireless RF Category | CDMA | |
| Circuit Topology Design | - | |
| Electrical Pathway | SP3T | |
| Operational Hz Spectrum | 500MHz ~ 2.5GHz | |
| Electrical Separation Rating | 27dB | |
| Signal Insertion Attenuation | 0.7dB | |
| Benchmark Hz Rate | 2GHz | |
| 1dB Compression Point | - | |
| Third-Order Intercept Point | 66dBm | |
| Key Product Highlights | - | |
| AC Resistance Value | 50Ohm | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -30°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 12-VFQFN Exposed Pad | |
| Vendor Package Type | 12-QFN (3x3) |
Description
Set up to circuit type characterized as SP3T. Provides a 500MHz ~ 2.5GHz frequency range for wide-spectrum applications. Accommodates 66dBm IIP3 for linearity and RF efficiency. Set with 50Ohm impedance to ensure signal integrity. Provides 0.7dB insertion loss for reduced signal attenuation. Provides 27dB isolation to avoid electrical interference. Mounting style Surface Mount for structural integrity. Operating temperature -30°C ~ 85°C for thermal stability. Enclosure Bulk for component protection or transport. Enclosure/case 12-VFQFN Exposed Pad providing mechanical and thermal shielding. Enclosure type 12-QFN (3x3) ensuring device integrity. Product condition Active for availability and lifecycle. Type of RF CDMA for specifications on frequency and modulation. Manufacturer package type 12-QFN (3x3) for component choice. Frequency test 2GHz for performance assessment.