F2M03MLA-S03

F2M03MLA-S03

Data Sheet

Attribute
Description
Manufacturer Part Number
F2M03MLA-S03
Manufacturer
Description
RF TXRX MOD BLUETOOTH CHIP SMD
Manufacturer Lead Time
Not specified

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tape & Reel (TR)
Availability Status Obsolete
Radio Frequency Protocol Bluetooth
Communication Standard Bluetooth v2.0 +EDR, Class 1, 2 and 3
Signal Modulation Technique -
Oscillation Rate Hz 2.4GHz
Transfer Speed Mbps 1.5Mbps
Output Wattage Rating 8dBm
Response Sensitivity Level -86dBm
Serial Communication Ports I2S, PIO, SPI, UART
RF Antenna Design Integrated, Chip
Core Integrated Circuit -
Total Memory Bytes -
Power Supply Voltage 3.1V ~ 3.6V
Receive Mode Amps -
Transmit Mode Amps -
Attachment Mounting Style Surface Mount
Ambient Temp Range -40°C ~ 85°C
Component Housing Style Module

Description

Features a Integrated, Chip antenna type for better signal reception. Supports a data transfer rate quantified at 1.5Mbps for high-speed operations. Boasts a sampling rate performance indicated as 1.5Mbps. Operates at a frequency of 2.4GHz. Mounting style Surface Mount for structural integrity. Operating temperature -40°C ~ 85°C for thermal stability. Enclosure Tape & Reel (TR) for component protection or transport. Enclosure/case Module providing mechanical and thermal shielding. Power output 8dBm for optimal device performance. Product condition Obsolete for availability and lifecycle. Communication protocol Bluetooth v2.0 +EDR, Class 1, 2 and 3 for control or interaction. RF standard or family Bluetooth for communication standards. Sensor or input response sensitivity -86dBm. Communication ports serial interfaces I2S, PIO, SPI, UART. Voltage supply 3.1V ~ 3.6V for electrical needs. Operating supply voltage 3.1V ~ 3.6V for the device.

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