| Part Numbers | Manufacturer Name | Datasheet | Core Processor | Core Size | Speed | Connectivity | RAM Size | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LPC2919FBD144/01/, | NXP SEMICONDUCTORS | ARM9 | 16/32-Bit | 80MHz | CAN, EBI/EMI, LIN, SPI, UART/USART | 108 | 768KB (768K x 8) | FLASH | - | 80K x 8 | 1.71 V ~ 3.6 V | A/D 16x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| SAK-XC2766X-96F66L AC | INFINEON TECHNOLOGIES AG | C166SV2 | 16/32-Bit | 66MHz | CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI | 75 | 768KB (768K x 8) | FLASH | - | 51K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 125°C | 100-LQFP Exposed Pad | |
| SAF-XE164F-96F80L AC | INFINEON TECHNOLOGIES AG | C166SV2 | 16-Bit | 80MHz | CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI | 75 | 768KB (768K x 8) | FLASH | - | 82K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 85°C | 100-LQFP Exposed Pad | |
| SAF-XE164F-96F66L AC | INFINEON TECHNOLOGIES AG | C166SV2 | 16-Bit | 66MHz | CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI | 75 | 768KB (768K x 8) | FLASH | - | 82K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 85°C | 100-LQFP Exposed Pad | |
| SAF-XE164H-96F66L AC | INFINEON TECHNOLOGIES AG | C166SV2 | 16-Bit | 66MHz | EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI | 75 | 768KB (768K x 8) | FLASH | - | 82K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 85°C | 100-LQFP Exposed Pad | |
| SAF-XE167G-96F66L AC | INFINEON TECHNOLOGIES AG | C166SV2 | 16-Bit | 66MHz | CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI | 118 | 768KB (768K x 8) | FLASH | - | 82K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 85°C | 144-LQFP Exposed Pad | |
| SAF-XE167K-96F66L AC | INFINEON TECHNOLOGIES AG | C166SV2 | 16-Bit | 66MHz | EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI | 118 | 768KB (768K x 8) | FLASH | - | 82K x 8 | 3 V ~ 5.5 V | A/D 16x10b | Internal | -40°C ~ 85°C | 144-LQFP Exposed Pad | |
| LPC2919FBD144,551 | NXP SEMICONDUCTORS | ARM9 | 16/32-Bit | 80MHz | CAN, EBI/EMI, LIN, SPI, UART/USART | 108 | 768KB (768K x 8) | FLASH | - | 80K x 8 | 1.71 V ~ 3.6 V | A/D 16x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| TMS470R1B768PGET | TEXAS INSTRUMENTS INC | ARM7 | 16/32-Bit | 60MHz | CAN, SCI, SPI | 86 | 768KB (768K x 8) | FLASH | - | 48K x 8 | 1.81 V ~ 2.05 V | A/D 16x10b | External | -40°C ~ 105°C | 144-LQFP | |
| TMS470R1B768PGE | TEXAS INSTRUMENTS INC | ARM7 | 16/32-Bit | 60MHz | CAN, SCI, SPI | 86 | 768KB (768K x 8) | FLASH | - | 48K x 8 | 1.81 V ~ 2.05 V | A/D 16x10b | External | -40°C ~ 85°C | 144-LQFP |
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