| Part Numbers | Manufacturer Name | Datasheet | Core Processor | Core Size | Speed | Connectivity | RAM Size | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| DF72115D160FPV | RENESAS ELECTRONICS CORP | SH-2A | 32-Bit | 160MHz | EBI/EMI, I²C, SCI | 73 | 512KB (512K x 8) | FLASH | - | 32K x 8 | 1.4 V ~ 1.6 V | A/D 8x12b; D/A 2x8b | External | -40°C ~ 85°C | 144-LQFP | |
| R8A77210C133BAV | RENESAS ELECTRONICS CORP | SH-DSP | 32-Bit | 133MHz | I²C, IrDA, SD, SCI, SIO, SIM, USB | 110 | - | ROMless | - | 16K x 8 | 1.4 V ~ 1.6 V | A/D 4x10b; D/A 2x8b | External | -20°C ~ 75°C | 256-LFBGA | |
| HD6417712BPV | RENESAS ELECTRONICS CORP | SH-3 DSP | 32-Bit | 200MHz | EBI/EMI, Ethernet, FIFO, SCI, SIO | 24 | - | ROMless | - | 16K x 8 | 1.4 V ~ 1.6 V | - | External | -20°C ~ 75°C | 256-LFBGA | |
| HD6417712FV | RENESAS ELECTRONICS CORP | SH-3 DSP | 32-Bit | 200MHz | EBI/EMI, Ethernet, FIFO, SCI, SIO | 24 | - | ROMless | - | 16K x 8 | 1.4 V ~ 1.6 V | - | External | -20°C ~ 75°C | 256-BFQFP Exposed Pad | |
| HD6417705BP133BV | RENESAS ELECTRONICS CORP | SH-3 | 32-Bit | 133MHz | EBI/EMI, FIFO, IrDA, SCI, USB | 105 | - | ROMless | - | 32K x 8 | 1.4 V ~ 1.6 V | A/D 4x10b | Internal | -20°C ~ 75°C | 208-TFBGA | |
| HD6417705F133BV | RENESAS ELECTRONICS CORP | SH-3 | 32-Bit | 133MHz | EBI/EMI, FIFO, IrDA, SCI, USB | 105 | - | ROMless | - | 32K x 8 | 1.4 V ~ 1.6 V | A/D 4x10b | Internal | -20°C ~ 75°C | 208-LQFP | |
| R8A77210C133BGV | RENESAS ELECTRONICS CORP | SH-DSP | 32-Bit | 133MHz | I²C, IrDA, SD, SCI, SIO, SIM, USB | 114 | - | ROMless | - | 16K x 8 | 1.4 V ~ 1.6 V | A/D 4x10b; D/A 2x8b | External | -20°C ~ 75°C | 81-LFBGA | |
| HD6417720BP133CV | RENESAS ELECTRONICS CORP | SH-3 DSP | 32-Bit | 133MHz | FIFO, I²C, IrDA, Memory Card, SCI, SD, SIO, SIM, U | 117 | - | ROMless | - | 16K x 8 | 1.4 V ~ 1.6 V | A/D 4x10b; D/A 2x8b | Internal | -20°C ~ 75°C | 256-LFBGA | |
| HD6417750RF240V | RENESAS ELECTRONICS CORP | SH-4 | 32-Bit | 240MHz | EBI/EMI, FIFO, SCI, SmartCard | 28 | - | ROMless | - | 48K x 8 | 1.4 V ~ 1.6 V | - | External | -20°C ~ 75°C | 208-BFQFP Exposed Pad | |
| D17618ABGW100V | RENESAS ELECTRONICS CORP | SH-2 | 32-Bit | 100MHz | Ethernet, Host Interface, FIFO, SCI | 71 | - | ROMless | - | 4K x 8 | 1.4 V ~ 1.6 V | - | Internal | -40°C ~ 85°C | 176-LFBGA |
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