Manufacture :NXP SEMICONDUCTORS
32-VFQFN Exposed Pad,Package / Case
9 parts found
Part Numbers Manufacturer Name Datasheet Core Processor Core Size Speed Connectivity RAM Size Number of I/O Program Memory Size Program Memory Type EEPROM Size Voltage - Supply (Vcc/Vdd) Data Converters Oscillator Type Operating Temperature Package / Case
LPC11U35FHI33/501, NXP SEMICONDUCTORS
- 32-Bit 50MHz I²C, Microwire, SmartCard, SPI, SSP, UART/USART, U 26 64KB (64K x 8) FLASH 4K x 8 12K x 8 1.8 V ~ 3.6 V A/D 8x10b Internal -40°C ~ 85°C 32-VFQFN Exposed Pad
LPC1112FHI33/202,5 NXP SEMICONDUCTORS
- 32-Bit 50MHz I²C, SPI, UART/USART 28 16KB (16K x 8) FLASH - 4K x 8 1.8 V ~ 3.6 V A/D 8x10b Internal -40°C ~ 85°C 32-VFQFN Exposed Pad
LPC1114FHI33/302,5 NXP SEMICONDUCTORS
- 32-Bit 50MHz I²C, SPI, UART/USART 28 32KB (32K x 8) FLASH - 8K x 8 1.8 V ~ 3.6 V A/D 8x10b Internal -40°C ~ 85°C 32-VFQFN Exposed Pad
LPC1114LVFHI33/303 NXP SEMICONDUCTORS
- 32-Bit 50MHz I²C, SPI, UART/USART 27 32KB (32K x 8) FLASH - 8K x 8 1.65 V ~ 1.95 V A/D 8x8b Internal -40°C ~ 85°C 32-VFQFN Exposed Pad
LPC11U24FHI33/301, NXP SEMICONDUCTORS
- 32-Bit 50MHz I²C, Microwire, SPI, SSI, SSP, UART/USART, USB 26 32KB (32K x 8) FLASH 2K x 8 8K x 8 1.8 V ~ 3.6 V A/D 8x10b Internal -40°C ~ 85°C 32-VFQFN Exposed Pad
LPC11A13FHI33/201, NXP SEMICONDUCTORS
- 32-Bit 50MHz I²C, Microwire, SPI, SSI, SSP, UART/USART 28 24KB (24K x 8) FLASH 2K x 8 6K x 8 2.6 V ~ 3.6 V A/D 8x10b; D/A 1x10b Internal -40°C ~ 85°C 32-VFQFN Exposed Pad
LPC1112FHI33/102,5 NXP SEMICONDUCTORS
- 32-Bit 50MHz I²C, SPI, UART/USART 28 16KB (16K x 8) FLASH - 2K x 8 1.8 V ~ 3.6 V A/D 8x10b Internal -40°C ~ 85°C 32-VFQFN Exposed Pad
LPC1112LVFHI33/103 NXP SEMICONDUCTORS
- 32-Bit 50MHz I²C, SPI, UART/USART 27 16KB (16K x 8) FLASH - 4K x 8 1.65 V ~ 1.95 V A/D 6x8b Internal -40°C ~ 85°C 32-VFQFN Exposed Pad
A7001AGHN1/T1AG315 NXP SEMICONDUCTORS
MX51 - - - - - - EEPROM - 1.62 V ~ 5.5 V - - -25°C ~ 85°C 32-VFQFN Exposed Pad