| Part Numbers | Manufacturer Name | Datasheet | Core Processor | Core Size | Speed | Connectivity | RAM Size | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LPC4320FBD144,551 | NXP SEMICONDUCTORS | - | 32-Bit Dual-Core | 204MHz | CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, | 83 | - | ROMless | - | 200K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| LPC4310FBD144,551 | NXP SEMICONDUCTORS | - | 32-Bit Dual-Core | 204MHz | CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, | 83 | - | ROMless | - | 168K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| LPC2210FBD144/01,5 | NXP SEMICONDUCTORS | ARM7 | 16/32-Bit | 60MHz | EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | 76 | - | ROMless | - | 16K x 8 | 1.65 V ~ 3.6 V | A/D 8x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| LPC1810FBD144,551 | NXP SEMICONDUCTORS | - | 32-Bit | 180MHz | CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, | 83 | - | ROMless | - | 136K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| LPC1820FBD144,551 | NXP SEMICONDUCTORS | - | 32-Bit | 180MHz | CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, | 83 | - | ROMless | - | 168K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| LPC1830FBD144,551 | NXP SEMICONDUCTORS | - | 32-Bit | 180MHz | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, | 83 | - | ROMless | - | 200K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| LPC2290FBD144/01,5 | NXP SEMICONDUCTORS | ARM7 | 16/32-Bit | 60MHz | CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/ | 76 | - | ROMless | - | 64K x 8 | 1.65 V ~ 3.6 V | A/D 8x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| LPC4330FBD144,551 | NXP SEMICONDUCTORS | - | 32-Bit Dual-Core | 204MHz | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, | 83 | - | ROMless | - | 264K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| LPC1830FBD144K | NXP SEMICONDUCTORS | - | 32-Bit | 180MHz | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, | 83 | - | ROMless | - | 200K x 8 | 2.2 V ~ 3.6 V | A/D 8x10b; D/A 1x10b | Internal | -40°C ~ 85°C | 144-LQFP | |
| LH75411N0Q100C0;55 | NXP SEMICONDUCTORS | ARM7 | 32-Bit | 84MHz | EBI/EMI, SPI, SSI, SSP, UART/USART | 76 | - | ROMless | - | 32K x 8 | 1.7 V ~ 3.6 V | A/D 8x10b | External | -40°C ~ 85°C | 144-LQFP |
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