MAX814NESA+ |
MAXIM INTEGRATED PRODUCTS INC |
|
1
|
Push-Pull, Push-Pull
|
Active High/Active Low
|
140 ms Minimum
|
4.55V
|
-40?C ~ 85?C
|
Surface Mount
|
8-SOIC (0.154", 3.90mm Width)
|
MAX815NESA+ |
MAXIM INTEGRATED PRODUCTS INC |
|
1
|
Push-Pull, Totem Pole
|
Active Low
|
140 ms Minimum
|
4.55V
|
-40?C ~ 85?C
|
Surface Mount
|
8-SOIC (0.154", 3.90mm Width)
|
MAX815NEPA+ |
MAXIM INTEGRATED PRODUCTS INC |
|
1
|
Push-Pull, Totem Pole
|
Active Low
|
140 ms Minimum
|
4.55V
|
-40?C ~ 85?C
|
Through Hole
|
8-DIP (0.300", 7.62mm)
|
MAX814NESA+T |
MAXIM INTEGRATED PRODUCTS INC |
|
1
|
Push-Pull, Push-Pull
|
Active High/Active Low
|
140 ms Minimum
|
4.55V
|
-40?C ~ 85?C
|
Surface Mount
|
8-SOIC (0.154", 3.90mm Width)
|
MAX815NESA+T |
MAXIM INTEGRATED PRODUCTS INC |
|
1
|
Push-Pull, Totem Pole
|
Active Low
|
140 ms Minimum
|
4.55V
|
-40?C ~ 85?C
|
Surface Mount
|
8-SOIC (0.154", 3.90mm Width)
|
MAX814NEPA+ |
MAXIM INTEGRATED PRODUCTS INC |
|
1
|
Push-Pull, Push-Pull
|
Active High/Active Low
|
140 ms Minimum
|
4.55V
|
-40?C ~ 85?C
|
Through Hole
|
8-DIP (0.300", 7.62mm)
|
PCF1252-1T/F4,112 |
NXP SEMICONDUCTORS |
|
1
|
Push-Pull, Totem Pole
|
Active High
|
400 ?s Minimum
|
4.55V
|
-40?C ~ 85?C
|
Surface Mount
|
8-SOIC (0.154", 3.90mm Width)
|
PCF1252-1T/F4,118 |
NXP SEMICONDUCTORS |
|
1
|
Push-Pull, Totem Pole
|
Active High
|
400 ?s Minimum
|
4.55V
|
-40?C ~ 85?C
|
Surface Mount
|
8-SOIC (0.154", 3.90mm Width)
|
CAX809HTBI-T3 |
ON SEMICONDUCTOR |
|
1
|
Push-Pull, Totem Pole
|
Active Low
|
140 ms Minimum
|
4.55V
|
-40?C ~ 85?C
|
Surface Mount
|
TO-236-3, SC-59, SOT-23-3
|
CAT809HTBI-T3 |
ON SEMICONDUCTOR |
|
1
|
Push-Pull, Totem Pole
|
Active Low
|
140 ms Minimum
|
4.55V
|
-40?C ~ 85?C
|
Surface Mount
|
TO-236-3, SC-59, SOT-23-3
|