M308A5SGP#U5 |
RENESAS ELECTRONICS CORP |
|
M32C/80
|
16/32-Bit
|
32MHz
|
EBI/EMI, I²C, IEBus, UART/USART
|
81
|
-
|
ROMless
|
-
|
24K x 8
|
3 V ~ 5.5 V
|
A/D 18x10b, D/A 2x8b
|
Internal
|
-20°C ~ 85°C
|
144-LQFP
|
DS61650CW50FPV |
RENESAS ELECTRONICS CORP |
|
H8SX
|
32-Bit
|
50MHz
|
SCI, SmartCard
|
82
|
-
|
ROMless
|
-
|
24K x 8
|
3 V ~ 3.6 V
|
-
|
Internal
|
-20°C ~ 75°C
|
120-LQFP
|
DS61650CN50FPV |
RENESAS ELECTRONICS CORP |
|
H8SX
|
32-Bit
|
50MHz
|
SCI, SmartCard
|
82
|
-
|
ROMless
|
-
|
24K x 8
|
3 V ~ 3.6 V
|
-
|
Internal
|
-20°C ~ 75°C
|
120-LQFP
|
HD6417750SF167V |
RENESAS ELECTRONICS CORP |
|
SH-4
|
32-Bit
|
167MHz
|
EBI/EMI, FIFO, SCI, SmartCard
|
28
|
-
|
ROMless
|
-
|
24K x 8
|
1.6 V ~ 2 V
|
-
|
External
|
-20°C ~ 75°C
|
208-BFQFP Exposed Pad
|
HD6417750SF200V |
RENESAS ELECTRONICS CORP |
|
SH-4
|
32-Bit
|
200MHz
|
EBI/EMI, FIFO, SCI, SmartCard
|
28
|
-
|
ROMless
|
-
|
24K x 8
|
1.8 V ~ 2.07 V
|
-
|
External
|
-20°C ~ 75°C
|
208-BFQFP Exposed Pad
|
HD6417751F167V |
RENESAS ELECTRONICS CORP |
|
SH-4
|
32-Bit
|
167MHz
|
EBI/EMI, FIFO, SCI, SmartCard
|
39
|
-
|
ROMless
|
-
|
24K x 8
|
1.6 V ~ 2 V
|
-
|
External
|
-20°C ~ 75°C
|
256-BFQFP Exposed Pad
|
HD6417750F167V |
RENESAS ELECTRONICS CORP |
|
SH-4
|
32-Bit
|
167MHz
|
EBI/EMI, FIFO, SCI, SmartCard
|
28
|
-
|
ROMless
|
-
|
24K x 8
|
1.6 V ~ 2 V
|
-
|
External
|
-20°C ~ 75°C
|
208-BFQFP Exposed Pad
|
HD6417750F167 |
RENESAS ELECTRONICS CORP |
|
SH-4
|
32-Bit
|
167MHz
|
EBI/EMI, FIFO, SCI, SmartCard
|
28
|
-
|
ROMless
|
-
|
24K x 8
|
1.6 V ~ 2 V
|
-
|
External
|
-20°C ~ 75°C
|
208-BFQFP Exposed Pad
|
HD6417750SF167I |
RENESAS ELECTRONICS CORP |
|
SH-4
|
32-Bit
|
167MHz
|
EBI/EMI, FIFO, SCI, SmartCard
|
28
|
-
|
ROMless
|
-
|
24K x 8
|
1.6 V ~ 2 V
|
-
|
External
|
-40°C ~ 85°C
|
208-BFQFP Exposed Pad
|
HD6417750SF200 |
RENESAS ELECTRONICS CORP |
|
SH-4
|
32-Bit
|
200MHz
|
EBI/EMI, FIFO, SCI, SmartCard
|
28
|
-
|
ROMless
|
-
|
24K x 8
|
1.8 V ~ 2.07 V
|
-
|
External
|
-20°C ~ 75°C
|
208-BFQFP Exposed Pad
|