CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/,Connectivity
ROMless,Program Memory Size
3 parts found
Part Numbers Manufacturer Name Datasheet Core Processor Core Size Speed Connectivity RAM Size Number of I/O Program Memory Size Program Memory Type EEPROM Size Voltage - Supply (Vcc/Vdd) Data Converters Oscillator Type Operating Temperature Package / Case
LPC2290FBD144/01,5 NXP SEMICONDUCTORS
ARM7 16/32-Bit 60MHz CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/ 76 - ROMless - 64K x 8 1.65 V ~ 3.6 V A/D 8x10b Internal -40°C ~ 85°C 144-LQFP
LPC1820FET100,551 NXP SEMICONDUCTORS
- 32-Bit 150MHz CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/ 64 - ROMless - 168K x 8 2 V ~ 3.6 V A/D 12x10b; D/A 1x10b Internal -40°C ~ 85°C 100-TFBGA
LPC2290FBD144,551 NXP SEMICONDUCTORS
ARM7 16/32-Bit 60MHz CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/ 76 - ROMless - 16K x 8 1.65 V ~ 3.6 V A/D 8x10b Internal -40°C ~ 85°C 144-LQFP