ROMless,Program Memory Size
208-TFBGA,Package / Case
8 parts found
Part Numbers Manufacturer Name Datasheet Core Processor Core Size Speed Connectivity RAM Size Number of I/O Program Memory Size Program Memory Type EEPROM Size Voltage - Supply (Vcc/Vdd) Data Converters Oscillator Type Operating Temperature Package / Case
LPC2470FET208,551 NXP SEMICONDUCTORS
ARM7 16/32-Bit 72MHz CAN, EBI/EMI, Ethernet, I²C, Microwire, Memory Car 160 - ROMless - 98K x 8 3 V ~ 3.6 V A/D 8x10b; D/A 1x10b Internal -40°C ~ 85°C 208-TFBGA
LPC2460FET208,551 NXP SEMICONDUCTORS
ARM7 16/32-Bit 72MHz CAN, EBI/EMI, Ethernet, I²C, Microwire, Memory Car 160 - ROMless - 96K x 8 3 V ~ 3.6 V A/D 8x10b; D/A 1x10b Internal -40°C ~ 85°C 208-TFBGA
LPC2420FET208,551 NXP SEMICONDUCTORS
ARM7 16/32-Bit 72MHz EBI/EMI, I²C, Microwire, Memory Card, SPI, SSI, SS 160 - ROMless - 82K x 8 3 V ~ 3.6 V A/D 8x10b; D/A 1x10b Internal -40°C ~ 85°C 208-TFBGA
LPC3154FET208,551 NXP SEMICONDUCTORS
ARM9 16/32-Bit 180MHz EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/US 10 - ROMless - 192K x 8 1.1 V ~ 3.6 V A/D 3x10b External -40°C ~ 85°C 208-TFBGA
LPC3152FET208,551 NXP SEMICONDUCTORS
ARM9 16/32-Bit 180MHz EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/US 10 - ROMless - 192K x 8 1.1 V ~ 3.6 V A/D 3x10b External -40°C ~ 85°C 208-TFBGA
HD6417705BP133BV RENESAS ELECTRONICS CORP
SH-3 32-Bit 133MHz EBI/EMI, FIFO, IrDA, SCI, USB 105 - ROMless - 32K x 8 1.4 V ~ 1.6 V A/D 4x10b Internal -20°C ~ 75°C 208-TFBGA
HD6417705BP100BV RENESAS ELECTRONICS CORP
SH-3 32-Bit 100MHz EBI/EMI, FIFO, IrDA, SCI, USB 105 - ROMless - 32K x 8 1.4 V ~ 1.6 V A/D 4x10b Internal -20°C ~ 75°C 208-TFBGA
HD6417705BP133V RENESAS ELECTRONICS CORP
SH-3 32-Bit 133MHz EBI/EMI, FIFO, IrDA, SCI, USB 105 - ROMless - 32K x 8 1.4 V ~ 1.6 V A/D 4x10b Internal -20°C ~ 75°C 208-TFBGA