LPC2470FET208,551 |
NXP SEMICONDUCTORS |
|
ARM7
|
16/32-Bit
|
72MHz
|
CAN, EBI/EMI, Ethernet, I²C, Microwire, Memory Car
|
160
|
-
|
ROMless
|
-
|
98K x 8
|
3 V ~ 3.6 V
|
A/D 8x10b; D/A 1x10b
|
Internal
|
-40°C ~ 85°C
|
208-TFBGA
|
LPC2460FET208,551 |
NXP SEMICONDUCTORS |
|
ARM7
|
16/32-Bit
|
72MHz
|
CAN, EBI/EMI, Ethernet, I²C, Microwire, Memory Car
|
160
|
-
|
ROMless
|
-
|
96K x 8
|
3 V ~ 3.6 V
|
A/D 8x10b; D/A 1x10b
|
Internal
|
-40°C ~ 85°C
|
208-TFBGA
|
LPC2420FET208,551 |
NXP SEMICONDUCTORS |
|
ARM7
|
16/32-Bit
|
72MHz
|
EBI/EMI, I²C, Microwire, Memory Card, SPI, SSI, SS
|
160
|
-
|
ROMless
|
-
|
82K x 8
|
3 V ~ 3.6 V
|
A/D 8x10b; D/A 1x10b
|
Internal
|
-40°C ~ 85°C
|
208-TFBGA
|
LPC3154FET208,551 |
NXP SEMICONDUCTORS |
|
ARM9
|
16/32-Bit
|
180MHz
|
EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/US
|
10
|
-
|
ROMless
|
-
|
192K x 8
|
1.1 V ~ 3.6 V
|
A/D 3x10b
|
External
|
-40°C ~ 85°C
|
208-TFBGA
|
LPC3152FET208,551 |
NXP SEMICONDUCTORS |
|
ARM9
|
16/32-Bit
|
180MHz
|
EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/US
|
10
|
-
|
ROMless
|
-
|
192K x 8
|
1.1 V ~ 3.6 V
|
A/D 3x10b
|
External
|
-40°C ~ 85°C
|
208-TFBGA
|
HD6417705BP133BV |
RENESAS ELECTRONICS CORP |
|
SH-3
|
32-Bit
|
133MHz
|
EBI/EMI, FIFO, IrDA, SCI, USB
|
105
|
-
|
ROMless
|
-
|
32K x 8
|
1.4 V ~ 1.6 V
|
A/D 4x10b
|
Internal
|
-20°C ~ 75°C
|
208-TFBGA
|
HD6417705BP100BV |
RENESAS ELECTRONICS CORP |
|
SH-3
|
32-Bit
|
100MHz
|
EBI/EMI, FIFO, IrDA, SCI, USB
|
105
|
-
|
ROMless
|
-
|
32K x 8
|
1.4 V ~ 1.6 V
|
A/D 4x10b
|
Internal
|
-20°C ~ 75°C
|
208-TFBGA
|
HD6417705BP133V |
RENESAS ELECTRONICS CORP |
|
SH-3
|
32-Bit
|
133MHz
|
EBI/EMI, FIFO, IrDA, SCI, USB
|
105
|
-
|
ROMless
|
-
|
32K x 8
|
1.4 V ~ 1.6 V
|
A/D 4x10b
|
Internal
|
-20°C ~ 75°C
|
208-TFBGA
|