| Part Numbers | Manufacturer Name | Datasheet | Core Processor | Core Size | Speed | Connectivity | RAM Size | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MB95F332HPMC-G-SNE2 | FUJITSU SEMICONDUCTOR AMERICA INC | F²MC-8FX | 8-Bit | 16MHz | I²C, LIN, SIO, UART/USART | 28 | 8KB (8K x 8) | FLASH | - | 240 x 8 | 2.4 V ~ 5.5 V | A/D 8x8/10b | External | -40°C ~ 85°C | 32-LQFP | |
| MB95F334HPMC-G-SNE2 | FUJITSU SEMICONDUCTOR AMERICA INC | F²MC-8FX | 8-Bit | 16MHz | I²C, LIN, SIO, UART/USART | 28 | 20KB (20K x 8) | FLASH | - | 1008 x 8 | 2.4 V ~ 5.5 V | A/D 8x8/10b | External | -40°C ~ 85°C | 32-LQFP | |
| MPT612FBD48,151 | NXP SEMICONDUCTORS | ARM7 | 32-Bit | 70MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | 28 | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.65 V ~ 3.6 V | A/D 8x10b | External | -40°C ~ 85°C | 48-LQFP | |
| HD6417750SF167V | RENESAS ELECTRONICS CORP | SH-4 | 32-Bit | 167MHz | EBI/EMI, FIFO, SCI, SmartCard | 28 | - | ROMless | - | 24K x 8 | 1.6 V ~ 2 V | - | External | -20°C ~ 75°C | 208-BFQFP Exposed Pad | |
| HD6417750RF240V | RENESAS ELECTRONICS CORP | SH-4 | 32-Bit | 240MHz | EBI/EMI, FIFO, SCI, SmartCard | 28 | - | ROMless | - | 48K x 8 | 1.4 V ~ 1.6 V | - | External | -20°C ~ 75°C | 208-BFQFP Exposed Pad | |
| HD6417750SF200V | RENESAS ELECTRONICS CORP | SH-4 | 32-Bit | 200MHz | EBI/EMI, FIFO, SCI, SmartCard | 28 | - | ROMless | - | 24K x 8 | 1.8 V ~ 2.07 V | - | External | -20°C ~ 75°C | 208-BFQFP Exposed Pad | |
| HD6417750RF200V | RENESAS ELECTRONICS CORP | SH-4 | 32-Bit | 200MHz | EBI/EMI, FIFO, SCI, SmartCard | 28 | - | ROMless | - | 48K x 8 | 1.35 V ~ 1.6 V | - | External | -20°C ~ 75°C | 208-BFQFP Exposed Pad | |
| HD6417750F167V | RENESAS ELECTRONICS CORP | SH-4 | 32-Bit | 167MHz | EBI/EMI, FIFO, SCI, SmartCard | 28 | - | ROMless | - | 24K x 8 | 1.6 V ~ 2 V | - | External | -20°C ~ 75°C | 208-BFQFP Exposed Pad | |
| HD6417750F167 | RENESAS ELECTRONICS CORP | SH-4 | 32-Bit | 167MHz | EBI/EMI, FIFO, SCI, SmartCard | 28 | - | ROMless | - | 24K x 8 | 1.6 V ~ 2 V | - | External | -20°C ~ 75°C | 208-BFQFP Exposed Pad | |
| HD6417750RBP240 | RENESAS ELECTRONICS CORP | SH-4 | 32-Bit | 240MHz | EBI/EMI, FIFO, SCI, SmartCard | 28 | - | ROMless | - | 48K x 8 | 1.4 V ~ 1.6 V | - | External | -20°C ~ 75°C | 256-BBGA |
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