117,RAM Size
16K x 8,EEPROM Size
6 parts found
Part Numbers Manufacturer Name Datasheet Core Processor Core Size Speed Connectivity RAM Size Number of I/O Program Memory Size Program Memory Type EEPROM Size Voltage - Supply (Vcc/Vdd) Data Converters Oscillator Type Operating Temperature Package / Case
MC9S12XHZ256CAG FREESCALE SEMICONDUCTOR INC
HCS12X 16-Bit 80MHz CAN, EBI/EMI, I²C, LIN, SCI, SPI 117 256KB (256K x 8) FLASH 4K x 8 16K x 8 2.35 V ~ 5.5 V A/D 16x8/10b External -40°C ~ 85°C 144-LQFP
MC9S12XHZ256VAG FREESCALE SEMICONDUCTOR INC
HCS12X 16-Bit 80MHz CAN, EBI/EMI, I²C, LIN, SCI, SPI 117 256KB (256K x 8) FLASH 4K x 8 16K x 8 2.35 V ~ 5.5 V A/D 16x8/10b External -40°C ~ 105°C 144-LQFP
MC9S12XHZ256VAGR FREESCALE SEMICONDUCTOR INC
HCS12X 16-Bit 80MHz CAN, EBI/EMI, I²C, LIN, SCI, SPI 117 256KB (256K x 8) FLASH 4K x 8 16K x 8 2.35 V ~ 5.5 V A/D 16x8/10b External -40°C ~ 105°C 144-LQFP
HD6417720BP133CV RENESAS ELECTRONICS CORP
SH-3 DSP 32-Bit 133MHz FIFO, I²C, IrDA, Memory Card, SCI, SD, SIO, SIM, U 117 - ROMless - 16K x 8 1.4 V ~ 1.6 V A/D 4x10b; D/A 2x8b Internal -20°C ~ 75°C 256-LFBGA
HD6417720BL133CV RENESAS ELECTRONICS CORP
SH-3 DSP 32-Bit 133MHz FIFO, I²C, IrDA, Memory Card, SCI, SD, SIO, SIM, U 117 - ROMless - 16K x 8 1.4 V ~ 1.6 V A/D 4x10b; D/A 2x8b Internal -20°C ~ 75°C 256-LFBGA
HD6417720BP133BV RENESAS ELECTRONICS CORP
SH-3 DSP 32-Bit 133MHz FIFO, I²C, IrDA, Memory Card, SCI, SD, SIO, SIM, U 117 - ROMless - 16K x 8 1.4 V ~ 1.6 V A/D 4x10b; D/A 2x8b Internal -20°C ~ 75°C 256-LFBGA