208-BFQFP Exposed Pad,Package / Case
20 parts found
Part Numbers Manufacturer Name Datasheet Core Processor Core Size Speed Connectivity RAM Size Number of I/O Program Memory Size Program Memory Type EEPROM Size Voltage - Supply (Vcc/Vdd) Data Converters Oscillator Type Operating Temperature Package / Case
ADM5120PX-AB-T-2 INFINEON TECHNOLOGIES AG
4Kc - - - 16K x 8 - - - - 1.8V, 3.3V - - - 208-BFQFP Exposed Pad
D6417709SHF200BV RENESAS ELECTRONICS CORP
SH-3 32-Bit 200MHz EBI/EMI, FIFO, IrDA, SCI, SmartCard 96 - ROMless - 16K x 8 1.85 V ~ 2.15 V A/D 8x10b; D/A 2x8b Internal -20°C ~ 75°C 208-BFQFP Exposed Pad
HD6417750SF167V RENESAS ELECTRONICS CORP
SH-4 32-Bit 167MHz EBI/EMI, FIFO, SCI, SmartCard 28 - ROMless - 24K x 8 1.6 V ~ 2 V - External -20°C ~ 75°C 208-BFQFP Exposed Pad
D6417729RHF200BV RENESAS ELECTRONICS CORP
SH-3 DSP 32-Bit 200MHz EBI/EMI, FIFO, IrDA, SCI, SmartCard 96 - ROMless - 32K x 8 1.85 V ~ 2.15 V A/D 8x10b; D/A 2x8b Internal -20°C ~ 75°C 208-BFQFP Exposed Pad
HD6417750RF240V RENESAS ELECTRONICS CORP
SH-4 32-Bit 240MHz EBI/EMI, FIFO, SCI, SmartCard 28 - ROMless - 48K x 8 1.4 V ~ 1.6 V - External -20°C ~ 75°C 208-BFQFP Exposed Pad
HD6417750SF200V RENESAS ELECTRONICS CORP
SH-4 32-Bit 200MHz EBI/EMI, FIFO, SCI, SmartCard 28 - ROMless - 24K x 8 1.8 V ~ 2.07 V - External -20°C ~ 75°C 208-BFQFP Exposed Pad
HD6417750RF200V RENESAS ELECTRONICS CORP
SH-4 32-Bit 200MHz EBI/EMI, FIFO, SCI, SmartCard 28 - ROMless - 48K x 8 1.35 V ~ 1.6 V - External -20°C ~ 75°C 208-BFQFP Exposed Pad
HD6417750F167V RENESAS ELECTRONICS CORP
SH-4 32-Bit 167MHz EBI/EMI, FIFO, SCI, SmartCard 28 - ROMless - 24K x 8 1.6 V ~ 2 V - External -20°C ~ 75°C 208-BFQFP Exposed Pad
D6417709SHF200B RENESAS ELECTRONICS CORP
SH-3 32-Bit 200MHz EBI/EMI, FIFO, IrDA, SCI, SmartCard 96 - ROMless - 16K x 8 1.85 V ~ 2.15 V A/D 8x10b; D/A 2x8b Internal -20°C ~ 75°C 208-BFQFP Exposed Pad
HD6417750F167 RENESAS ELECTRONICS CORP
SH-4 32-Bit 167MHz EBI/EMI, FIFO, SCI, SmartCard 28 - ROMless - 24K x 8 1.6 V ~ 2 V - External -20°C ~ 75°C 208-BFQFP Exposed Pad