FCP0805H821J |
CORNELL-DUBILIER ELECTRONICS INC |
|
820pF
|
-
|
50V
|
Polyphenylene Sulfide (PPS)
|
±5%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
0805 (2012 Metric)
|
0.079" L x 0.049" W (2.00mm x 1.25mm)
|
0.043" (1.09mm)
|
Solder Pads
|
-
|
FCP0805H821G |
CORNELL-DUBILIER ELECTRONICS INC |
|
820pF
|
-
|
50V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
0805 (2012 Metric)
|
0.079" L x 0.049" W (2.00mm x 1.25mm)
|
0.043" (1.09mm)
|
Solder Pads
|
-
|
FCP0805H821J-J1 |
CORNELL-DUBILIER ELECTRONICS INC |
|
820pF
|
-
|
50V
|
Polyphenylene Sulfide (PPS)
|
±5%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
0805 (2012 Metric)
|
0.079" L x 0.049" W (2.00mm x 1.25mm)
|
0.043" (1.09mm)
|
Solder Pads
|
-
|
FCP0805H821G-J1 |
CORNELL-DUBILIER ELECTRONICS INC |
|
820pF
|
-
|
50V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
0805 (2012 Metric)
|
0.079" L x 0.049" W (2.00mm x 1.25mm)
|
0.043" (1.09mm)
|
Solder Pads
|
-
|