| Part Numbers | Manufacturer Name | Datasheet | Circuit Type | Resistance (Ohms) | Tolerance | Number of Resistors | Number of Pins | Power Per Element | Temperature Coefficient | Mounting Type | Package / Case | Size / Dimension | Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 4608X-101-683LF | BOURNS INC | Bussed | 68k | ±2% | 7 | 8 | 200mW | ±100ppm/°C | Through Hole | 8-SIP | 0.798" L x 0.098" W (20.27mm x 2.49mm) | 0.200" (5.08mm) | |
| 4608X-101-123LF | BOURNS INC | Bussed | 12k | ±2% | 7 | 8 | 200mW | ±100ppm/°C | Through Hole | 8-SIP | 0.798" L x 0.098" W (20.27mm x 2.49mm) | 0.200" (5.08mm) | |
| 4608X-101-682LF | BOURNS INC | Bussed | 6.8k | ±2% | 7 | 8 | 200mW | ±100ppm/°C | Through Hole | 8-SIP | 0.798" L x 0.098" W (20.27mm x 2.49mm) | 0.200" (5.08mm) | |
| 4608X-101-122LF | BOURNS INC | Bussed | 1.2k | ±2% | 7 | 8 | 200mW | ±100ppm/°C | Through Hole | 8-SIP | 0.798" L x 0.098" W (20.27mm x 2.49mm) | 0.200" (5.08mm) | |
| 4608X-101-821LF | BOURNS INC | Bussed | 820 | ±2% | 7 | 8 | 200mW | ±100ppm/°C | Through Hole | 8-SIP | 0.798" L x 0.098" W (20.27mm x 2.49mm) | 0.200" (5.08mm) | |
| SFN08B4701CBQLF7 | BI TECHNOLOGIES CORP | Bussed | 4.7k | ±0.25% | 7 | 8 | 100mW | ±25ppm/°C | Surface Mount | 8-DFN Exposed Pad | 0.157" L x 0.157" W (4.00mm x 4.00mm) | - | |
| SFN08B1001CBQLF7 | BI TECHNOLOGIES CORP | Bussed | 1k | ±0.25% | 7 | 8 | 100mW | ±25ppm/°C | Surface Mount | 8-DFN Exposed Pad | 0.157" L x 0.157" W (4.00mm x 4.00mm) | - | |
| SFN08B1002CBQLF7 | BI TECHNOLOGIES CORP | Bussed | 10k | ±0.25% | 7 | 8 | 100mW | ±25ppm/°C | Surface Mount | 8-DFN Exposed Pad | 0.157" L x 0.157" W (4.00mm x 4.00mm) | - | |
| SFN08B1003CBQLF7 | BI TECHNOLOGIES CORP | Bussed | 100k | ±0.25% | 7 | 8 | 100mW | ±25ppm/°C | Surface Mount | 8-DFN Exposed Pad | 0.157" L x 0.157" W (4.00mm x 4.00mm) | - | |
| SFN08B4702CBQLF7 | BI TECHNOLOGIES CORP | Bussed | 47k | ±0.25% | 7 | 8 | 100mW | ±25ppm/°C | Surface Mount | 8-DFN Exposed Pad | 0.157" L x 0.157" W (4.00mm x 4.00mm) | - |
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